Murayama; Ryuichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murayama; Ryuichi.The latest application filed is for "paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink".

Company Profile

1.8.15

Murayama; Ryuichi - Tokyo JP
Murayama; Ryuichi - Chiba N/A JP
Murayama; Ryuichi - Narashimo JP
Murayama; Ryuichi - Narashino-shi JP
Murayama; Ryuichi - Narashimo-City JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink Grant 10,259,976 - Shimobe , et al.	2019-04-16
Paste-like Adhesive Composition, Semiconductor Device, Method For Manufacturing Semiconductor Device, And Method For Bonding Heatsink App 20180340101 - SHIMOBE; Yasuo ; et al.	2018-11-29
Thermally Conductive Composition, Semiconductor Device, Method For Manufacturing Semiconductor Device, And Method For Bonding Heatsink App 20180194869 - SHIMOBE; Yasuo ; et al.	2018-07-12
Semiconductor device Grant 9,379,051 - Shimobe , et al. June 28, 2	2016-06-28
Semiconductor Device App 20150194376 - Shimobe; Yasuo ; et al.	2015-07-09
Resin Composition, Semiconductor Device Using Same, And Method Of Manufacturing Semiconductor Device App 20140341242 - Murayama; Ryuichi ; et al.	2014-11-20
Semiconductor Device App 20140183715 - Kanamori; Naoya ; et al.	2014-07-03
Resin composition and semiconductor device produced using resin composition Grant 8,754,178 - Kawana , et al. June 17, 2	2014-06-17
Liquid resin composition and semiconductor device Grant 8,722,768 - Makihara , et al. May 13, 2	2014-05-13
Resin Composition And Semiconductor Device App 20130289166 - Makihara; Kouji ; et al.	2013-10-31
Resin Composition And Semiconductor Device Produced Using Resin Composition App 20130158188 - Kawana; Takashi ; et al.	2013-06-20
Liquid Resin Composition And Semiconductor Device App 20130143983 - Makihara; Kouji ; et al.	2013-06-06
Die-attaching paste and semiconductor device Grant 6,861,013 - Tanaka , et al. March 1, 2	2005-03-01
Die-attaching paste and semiconductor device App 20030146521 - Tanaka, Nobuki ; et al.	2003-08-07

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