Murayama; Kumiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Murayama; Kumiko.The latest application filed is for "method for heat treating a silicon wafer".
- Murayama; Kumiko - Niigata N/A JP
- Murayama; Kumiko - Kitakanbara-gun JP
| Patent | Date |
|---|---|
| Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process Grant 8,476,149 - Isogai , et al. July 2, 2 | 2013-07-02 |
| Method for heat treating a silicon wafer Grant 8,399,341 - Senda , et al. March 19, 2 | 2013-03-19 |
| Method of heat treating silicon wafer Grant 8,252,700 - Senda , et al. August 28, 2 | 2012-08-28 |
| Method For Heat Treating A Silicon Wafer App 20120184091 - Senda; Takeshi ; et al. | 2012-07-19 |
| Manufacturing method for silicon wafer Grant 7,977,219 - Isogai , et al. July 12, 2 | 2011-07-12 |
| Method of heat treating silicon wafer App 20100197146 - Senda; Takeshi ; et al. | 2010-08-05 |
| Manufacturing Method For Silicon Wafer App 20100055884 - Isogai; Hiromichi ; et al. | 2010-03-04 |
| Silicon Wafer, Method For Manufacturing The Same And Method For Heat-treating The Same App 20100038757 - Isogai; Hiromichi ; et al. | 2010-02-18 |
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