MURAYAMA; Kei

Patent Applications and Registrations

Patent applications and USPTO patent grants for MURAYAMA; Kei.The latest application filed is for "semiconductor device".

Company Profile

5.128.149

MURAYAMA; Kei - Nagano-shi JP
Murayama; Kei - Nagano JP
Murayama; Kei - Osaka JP
Murayama; Kei - Nagano-Ken JP
Murayama; Kei - Ishikawa N/A JP
Murayama; Kei - Tokyo JP
Murayama; Kei - Sendai JP
Murayama; Kei - Sendai-shi JP
Murayama, Kei - Nagago-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device App 20220028774 - MURAYAMA; Kei ; et al.	2022-01-27
Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate Grant 10,959,328 - Kobayashi , et al. March 23, 2	2021-03-23
Wiring Substrate, Stacked Wiring Substrate, And Manufacturing Method Of Wiring Substrate App 20210007220 - Kobayashi; Naoki ; et al.	2021-01-07
Semiconductor device Grant 10,784,226 - Murayama Sept	2020-09-22
Semiconductor Device App 20190371757 - Murayama; Kei	2019-12-05
Conductive ball having a tin-based solder covering an outer surface of the copper ball Grant 10,446,513 - Murayama Oc	2019-10-15
Conductive ball and electronic device Grant 10,446,512 - Murayama Oc	2019-10-15
Conductive Ball And Electronic Device App 20190013285 - Murayama; Kei	2019-01-10
Conductive Ball And Electronic Device App 20190013286 - Murayama; Kei	2019-01-10
Power management device Grant 9,802,503 - Murayama October 31, 2	2017-10-31
Semiconductor device, heat conductor, and method for manufacturing semiconductor device Grant 9,716,053 - Murayama , et al. July 25, 2	2017-07-25
Wiring substrate and electronic component device Grant 9,633,964 - Murayama April 25, 2	2017-04-25
Interposer and semiconductor device including the same Grant 9,591,742 - Murayama , et al. March 7, 2	2017-03-07
Power control apparatus, method, program, and integrated circuit, and storage battery unit Grant 9,496,725 - Katou , et al. November 15, 2	2016-11-15
Wiring Substrate And Electronic Component Device App 20160276301 - MURAYAMA; Kei	2016-09-22
Information processing apparatus, information processing method, and program Grant 9,425,892 - Murayama , et al. August 23, 2	2016-08-23
Interposer and electronic component package Grant 9,374,889 - Murayama , et al. June 21, 2	2016-06-21
Semiconductor Device, Heat Conductor, And Method For Manufacturing Semiconductor Device App 20150327397 - Murayama; Kei ; et al.	2015-11-12
Electronic device Grant 9,179,568 - Murayama November 3, 2	2015-11-03
Information Processing Apparatus, Information Processing Method, And Program App 20150304022 - Murayama; Kei ; et al.	2015-10-22
Solder bump joining structure with low resistance joining member Grant 9,129,884 - Murayama September 8, 2	2015-09-08
Converter circuit including switch element unit Grant 9,112,421 - Murayama , et al. August 18, 2	2015-08-18
Connection structure, wiring substrate unit, electronic circuit part unit, and electronic apparatus Grant 9,105,989 - Murayama , et al. August 11, 2	2015-08-11
Semiconductor Device App 20150091162 - MURAYAMA; Kei	2015-04-02
Interposer And Semiconductor Device Including The Same App 20140362552 - Murayama; Kei ; et al.	2014-12-11
Vehicle Management System App 20140320062 - Murayama; Kei	2014-10-30
Interposer And Electronic Component Package App 20140293564 - MURAYAMA; Kei ; et al.	2014-10-02
Power Management Device App 20140285001 - Murayama; Kei	2014-09-25
Stacked semiconductor device and method of manufacturing the same Grant 8,841,760 - Murayama September 23, 2	2014-09-23
Semiconductor device Grant 8,836,119 - Murayama , et al. September 16, 2	2014-09-16
Heat radiation component and semiconductor package including same Grant 8,674,499 - Murayama , et al. March 18, 2	2014-03-18
Semiconductor Device App 20140042616 - MURAYAMA; Kei ; et al.	2014-02-13
Frame-attached anti-reflection glass and method of manufacturing the same Grant 8,622,556 - Murayama , et al. January 7, 2	2014-01-07
Electronic Device App 20130329385 - MURAYAMA; Kei	2013-12-12
Semiconductor device, and method of manufacturing the same Grant 8,598,684 - Murayama December 3, 2	2013-12-03
Power Control Apparatus, Method, Program, And Integrated Circuit, And Storage Battery Unit App 20130285610 - Katou; Tomomi ; et al.	2013-10-31
Connection Structure, Wiring Substrate Unit, Electronic Circuit Part Unit, And Electronic Apparatus App 20130284509 - Murayama; Kei ; et al.	2013-10-31
Stacked Semiconductor Device And Method Of Manufacturing The Same App 20130264695 - MURAYAMA; Kei	2013-10-10
Substrate and method for manufacturing the same Grant 8,481,863 - Shiraishi , et al. July 9, 2	2013-07-09
Converter Circuit App 20130135904 - Murayama; Kei ; et al.	2013-05-30
Semiconductor chip stacked body and method of manufacturing the same Grant 8,394,678 - Murayama , et al. March 12, 2	2013-03-12
Heat radiation package and semiconductor device Grant 8,368,206 - Shiraishi , et al. February 5, 2	2013-02-05
Wiring substrate and semiconductor device Grant 8,350,390 - Murayama , et al. January 8, 2	2013-01-08
Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole Grant 8,338,289 - Murayama , et al. December 25, 2	2012-12-25
Wiring board having heat intercepting member Grant 8,330,050 - Sakaguchi , et al. December 11, 2	2012-12-11
Semiconductor package and method of manufacturing the same Grant 8,227,909 - Sakaguchi , et al. July 24, 2	2012-07-24
Frame-attached Anti-reflection Glass And Method Of Manufacturing The Same App 20120154918 - Murayama; Kei ; et al.	2012-06-21
Wiring board and method of manufacturing the same Grant 8,183,469 - Sunohara , et al. May 22, 2	2012-05-22
Electronic component device, and method of manufacturing the same Grant 8,178,957 - Taguchi , et al. May 15, 2	2012-05-15
Semiconductor device and electronic apparatus of multi-chip packaging Grant 8,169,073 - Murayama , et al. May 1, 2	2012-05-01
Semiconductor device having an element mounted on a substrate and an electrical component connected to the element Grant 8,148,738 - Murayama , et al. April 3, 2	2012-04-03
Method of manufacturing wiring substrate Grant 8,137,497 - Sunohara , et al. March 20, 2	2012-03-20
Electronic component package and method of manufacturing the same, and electronic component device Grant 8,129,830 - Murayama March 6, 2	2012-03-06
Wiring board with switching function and method of manufacturing the same Grant 8,111,523 - Sunohara , et al. February 7, 2	2012-02-07
Method of manufacturing wiring substrate, and method of manufacturing semiconductor device Grant 8,108,993 - Higashi , et al. February 7, 2	2012-02-07
Silicon substrate for package Grant 8,106,484 - Shiraishi , et al. January 31, 2	2012-01-31
Lighting apparatus Grant 8,100,555 - Higashii , et al. January 24, 2	2012-01-24
Method of manufacturing wiring substrate and method of manufacturing semiconductor device Grant 8,080,122 - Sunohara , et al. December 20, 2	2011-12-20
Heat Radiation Component And Semiconductor Package Including Same App 20110291258 - MURAYAMA; Kei ; et al.	2011-12-01
Method for mounting electronic component on substrate and method for forming solder surface Grant 8,046,911 - Murayama November 1, 2	2011-11-01
Light-emitting device and method for manufacturing the same Grant 8,044,429 - Higashi , et al. October 25, 2	2011-10-25
Wiring board Grant 8,026,576 - Murayama , et al. September 27, 2	2011-09-27
Silicon interposer and method for manufacturing the same Grant 8,026,610 - Murayama September 27, 2	2011-09-27
Silicon Substrate For Package App 20110227218 - Shiraishi; Akinori ; et al.	2011-09-22
Positioning receiver Grant 8,022,872 - Katayama , et al. September 20, 2	2011-09-20
Electronic parts packaging structure and method of manufacturing the same Grant 8,003,895 - Sunohara , et al. August 23, 2	2011-08-23
Silicon substrate for package Grant 7,989,927 - Shiraishi , et al. August 2, 2	2011-08-02
Method of manufacturing substrate Grant 7,981,798 - Taguchi , et al. July 19, 2	2011-07-19
Semiconductor Package And Method Of Manufacturing The Same App 20110156242 - Sakaguchi; Hideaki ; et al.	2011-06-30
Wiring Substrate And Semiconductor Device App 20110147951 - MURAYAMA; Kei ; et al.	2011-06-23
Electronic parts packaging structure and method of manufacturing the same Grant 7,964,950 - Sunohara , et al. June 21, 2	2011-06-21
Semiconductor package Grant 7,960,820 - Shiraishi , et al. June 14, 2	2011-06-14
Electronic component and method for manufacturing the same Grant 7,948,092 - Murayama , et al. May 24, 2	2011-05-24
Wiring substrate Grant 7,911,048 - Murayama March 22, 2	2011-03-22
Semiconductor Chip Stacked Structure And Method Of Manufacturing Same App 20110062596 - MURAYAMA; Kei ; et al.	2011-03-17
Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same Grant 7,897,510 - Murayama , et al. March 1, 2	2011-03-01
Electronic component and method for manufacturing the same Grant 7,894,201 - Murayama , et al. February 22, 2	2011-02-22
Probe card Grant 7,888,953 - Taguchi , et al. February 15, 2	2011-02-15
Light-emitting Device And Method For Manufacturing The Same App 20110032710 - Higashi; Mitsutoshi ; et al.	2011-02-10
Semiconductor inspecting device Grant 7,884,632 - Shiraishi , et al. February 8, 2	2011-02-08
Method of manufacturing wiring board having a semiconductor thereon Grant 7,882,626 - Murayama , et al. February 8, 2	2011-02-08
Semiconductor Chip And Method Of Manufacturing The Same App 20110027990 - Murayama; Kei ; et al.	2011-02-03
Light emitting apparatus and manufacturing method therefor Grant 7,876,036 - Taguchi , et al. January 25, 2	2011-01-25
Semiconductor Device And Fabrication Method Thereof App 20100320598 - Murayama; Kei ; et al.	2010-12-23
Lighting Apparatus App 20100321936 - HIGASHI; Mitsutoshi ; et al.	2010-12-23
Light emitting device housing and a manufacturing method thereof, and light emitting apparatus using the same Grant 7,850,344 - Shiraishi , et al. December 14, 2	2010-12-14
Semiconductor chip and method of manufacturing the same Grant 7,843,068 - Murayama , et al. November 30, 2	2010-11-30
Light-emitting device and method for manufacturing the same Grant 7,838,897 - Higashi , et al. November 23, 2	2010-11-23
Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device Grant 7,834,438 - Shiraishi , et al. November 16, 2	2010-11-16
Semiconductor apparatus Grant 7,829,993 - Murayama , et al. November 9, 2	2010-11-09
Semiconductor device and method of manufacturing semiconductor device Grant 7,825,423 - Shiraishi , et al. November 2, 2	2010-11-02
Light-emitting device Grant 7,816,690 - Shiraishi , et al. October 19, 2	2010-10-19
Semiconductor Device, And Method Of Manufacturing The Same App 20100252912 - MURAYAMA; Kei	2010-10-07
Method for forming side wirings Grant 7,807,561 - Mizuno , et al. October 5, 2	2010-10-05
Positioning Receiver And Positioning Method For User Equipment App 20100248668 - Katayama; Hiroshi ; et al.	2010-09-30
Positioning Receiver And Positioning Method App 20100231444 - Miyano; Akifumi ; et al.	2010-09-16
Lighting apparatus Grant 7,794,112 - Higashi , et al. September 14, 2	2010-09-14
Method of manufacturing substrate Grant 7,795,140 - Taguchi , et al. September 14, 2	2010-09-14
Electronic Component Device, And Method Of Manufacturing The Same App 20100207218 - TAGUCHI; Yuichi ; et al.	2010-08-19
Semiconductor apparatus having side surface wiring Grant 7,777,349 - Murayama , et al. August 17, 2	2010-08-17
Semiconductor Chip Stacked Body And Method Of Manufacturing The Same App 20100133677 - Murayama; Kei ; et al.	2010-06-03
Method of producing light emitting apparatus Grant 7,708,613 - Taguchi , et al. May 4, 2	2010-05-04
Semiconductor device and method of manufacturing the same Grant 7,705,451 - Murayama , et al. April 27, 2	2010-04-27
Wiring Board And Method Of Manufacturing The Same App 20100096163 - SAKAGUCHI; Hideaki ; et al.	2010-04-22
Signal Capturing Apparatus And Signal Capturing Method App 20100099434 - Murayama; Kei ; et al.	2010-04-22
Positioning Receiver App 20100085251 - Katayama; Hiroshi ; et al.	2010-04-08
Electronic parts packaging structure and method of manufacturing the same Grant 7,691,673 - Sunohara , et al. April 6, 2	2010-04-06
Semiconductor device and method for manufacturing the same Grant 7,655,956 - Sunohara , et al. February 2, 2	2010-02-02
Method Of Manufacturing Wiring Substrate And Chip Tray App 20090300911 - Higashi; Mitsutoshi ; et al.	2009-12-10
Light emitting device and manufacturing method thereof Grant 7,622,747 - Taguchi , et al. November 24, 2	2009-11-24
Probe Card App 20090284276 - TAGUCHI; Yuichi ; et al.	2009-11-19
Silicon Interposer And Method For Manufacturing The Same App 20090283914 - Murayama; Kei	2009-11-19
Electronic parts packaging structure and method of manufacturing the same App 20090250257 - Sunohara; Masahiro ; et al.	2009-10-08
Method Of Manufacturing Wiring Substrate App 20090242107 - Sunohara; Masahiro ; et al.	2009-10-01
Method Of Manufacturing Wiring Substrate, And Method Of Manufacturing Semiconductor Device App 20090236024 - HIGASHI; Mitsutoshi ; et al.	2009-09-24
Method Of Manufacturing Wiring Substrate And Method Of Manufacturing Semiconductor Device App 20090236031 - Sunohara; Masahiro ; et al.	2009-09-24
Wiring Substrate And Method Of Manufacturing The Same, And Semiconductor Device And Method Of Manufacturing The Same App 20090236727 - MURAYAMA; Kei ; et al.	2009-09-24
Method Of Manufacturing Wiring Board And Method Of Manufacturing Semiconductor Package App 20090223046 - Murayama; Kei ; et al.	2009-09-10
Electronic parts packaging structure and method of manufacturing the same App 20090206471 - Sunohara; Masahiro ; et al.	2009-08-20
Semiconductor Inspecting Device App 20090206861 - SHIRAISHI; Akinori ; et al.	2009-08-20
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Grant 7,573,135 - Sunohara , et al. August 11, 2	2009-08-11
Wiring Board With Switching Function And Method Of Manufacturing The Same App 20090196001 - SUNOHARA; Masahiro ; et al.	2009-08-06
Wiring Board And Method Of Manufacturing The Same App 20090183911 - SUNOHARA; Masahiro ; et al.	2009-07-23
Electronic parts packaging structure and method of manufacturing the same Grant 7,563,987 - Sunohara , et al. July 21, 2	2009-07-21
Wiring substrate and electronic parts packaging structure Grant 7,557,450 - Murayama , et al. July 7, 2	2009-07-07
Electronic parts packaging structure Grant 7,545,049 - Sunohara , et al. June 9, 2	2009-06-09
Wiring Substrate And Method Of Manufacturing The Same App 20090134530 - Kurihara; Takashi ; et al.	2009-05-28
Electronic parts packaging structure and method of manufacturing the same Grant 7,530,163 - Sunohara , et al. May 12, 2	2009-05-12
Semiconductor Package App 20090115049 - Shiraishi; Akinori ; et al.	2009-05-07
Silicon Substrate For Package App 20090108411 - Shiraishi; Akinori ; et al.	2009-04-30
Inkjet printer Grant 7,524,025 - Murayama April 28, 2	2009-04-28
Substrate Dividing Method App 20090098712 - Taguchi; Yuichi ; et al.	2009-04-16
Semiconductor Package And Manufacturing Method Thereof App 20090095974 - Taguchi; Yuichi ; et al.	2009-04-16
Flip-chip Mounting Apparatus App 20090090468 - Murayama; Kei	2009-04-09
Method Of Manufacturing Substrate App 20090093117 - Taguchi; Yuichi ; et al.	2009-04-09
Wiring Board App 20090085164 - Murayama; Kei ; et al.	2009-04-02
Method Of Manufacturing Substrate App 20090081867 - TAGUCHI; Yuichi ; et al.	2009-03-26
Electronic component device Grant 7,508,057 - Shiraishi , et al. March 24, 2	2009-03-24
Spherical Body Sorter And Spherical Body Sorting Apparatus Using The Same, And Spherical Body Sorting Method App 20090071882 - Murayama; Kei	2009-03-19
Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Grant 7,498,200 - Sunohara , et al. March 3, 2	2009-03-03
Method for manufacturing semiconductor device Grant 7,494,898 - Sunohara , et al. February 24, 2	2009-02-24
Heat Radiation Package And Semiconductor Device App 20090039379 - Shiraishi; Akinori ; et al.	2009-02-12
Semiconductor device and manufacturing method of semiconductor device Grant 7,488,094 - Murayama , et al. February 10, 2	2009-02-10
Semiconductor Apparatus And Manufacturing Method Thereof App 20090020889 - MURAYAMA; Kei ; et al.	2009-01-22
Semiconductor Apparatus And Manufacturing Method Thereof App 20090020887 - MIZUNO; Shigeru ; et al.	2009-01-22
Method For Forming Side Wirings App 20090023247 - MIZUNO; Shigeru ; et al.	2009-01-22
Semiconductor device and semiconductor device fabrication method App 20090014735 - Higashi; Mitsutoshi ; et al.	2009-01-15
Optical device Grant 7,470,891 - Koizumi , et al. December 30, 2	2008-12-30
Wiring Substrate App 20080315367 - MURAYAMA; Kei	2008-12-25
Electronic Component Package And Method Of Manufacturing The Same, And Electronic Component Device App 20080315230 - MURAYAMA; Kei	2008-12-25
Solder Supplying Method App 20080290136 - Murayama; Kei	2008-11-27
Substrate And Method For Manufacturing The Same App 20080251287 - SHIRAISHI; Akinori ; et al.	2008-10-16
Electronic component embedded substrate and method for manufacturing the same Grant 7,420,128 - Sunohara , et al. September 2, 2	2008-09-02
Electronic Component App 20080150109 - Sunohara; Masahiro ; et al.	2008-06-26
Light Emitting Device Housing And A Manufacturing Method Thereof, And Light Emitting Apparatus Using The Same App 20080123344 - Shiraishi; Akinori ; et al.	2008-05-29
Lighting apparatus App 20080123337 - Higashi; Mitsutoshi ; et al.	2008-05-29
Electronic Component And Method For Manufacturing The Same App 20080117607 - Murayama; Kei ; et al.	2008-05-22
Electronic Component And Method For Manufacturing The Same App 20080116566 - Murayama; Kei ; et al.	2008-05-22
Method For Mounting Electronic Component On Substrate And Method For Forming Solder Surface App 20080099535 - Murayama; Kei	2008-05-01
Electronic component device App 20080073768 - Shiraishi; Akinori ; et al.	2008-03-27
Semiconductor apparatus App 20080061424 - Murayama; Kei ; et al.	2008-03-13
Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same App 20080054486 - Murayama; Kei ; et al.	2008-03-06
Electrical characteristic measuring probe and method of manufacturing the same Grant 7,330,037 - Koizumi , et al. February 12, 2	2008-02-12
Semiconductor device and method of manufacturing the same App 20080029852 - Murayama; Kei ; et al.	2008-02-07
Light-emitting device App 20080030139 - Shiraishi; Akinori ; et al.	2008-02-07
Electronic parts packaging structure and method of manufacturing the same App 20080011508 - Sunohara; Masahiro ; et al.	2008-01-17
Semiconductor device and method of manufacturing semiconductor device App 20070290329 - Murayama; Kei ; et al.	2007-12-20
Electronic parts packaging structure and method of manufacturing the same Grant 7,285,728 - Sunohara , et al. October 23, 2	2007-10-23
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Grant 7,285,862 - Sunohara , et al. October 23, 2	2007-10-23
Wiring board mounting a capacitor Grant 7,279,771 - Sunohara , et al. October 9, 2	2007-10-09
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film App 20070222062 - Sunohara; Masahiro ; et al.	2007-09-27
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film App 20070224731 - Sunohara; Masahiro ; et al.	2007-09-27
Semiconductor device and method of manufacturing semiconductor device App 20070194712 - Shiraishi; Akinori ; et al.	2007-08-23
Light-emitting Device And Method For Manufacturing The Same App 20070187706 - Higashi; Mitsutoshi ; et al.	2007-08-16
Light emitting apparatus and manufacturing method therefor App 20070182307 - Taguchi; Yuichi ; et al.	2007-08-09
Optical Device App 20070181778 - Koizumi; Naoyuki ; et al.	2007-08-09
Sealed Structure And Method Of Fabricating Sealed Structure And Semiconductor Device And Method Of Fabricating Semiconductor Device App 20070177360 - Shiraishi; Akinori ; et al.	2007-08-02
Semiconductor device and method of manufacturing semiconductor device App 20070176197 - Shiraishi; Akinori ; et al.	2007-08-02
Optical waveguide mounting member, substrate, semiconductor device, method of manufacturing optical waveguide mounting member, and method of manufacturing substrate Grant 7,251,391 - Murayama July 31, 2	2007-07-31
Method of producing light emitting apparatus App 20070173165 - Taguchi; Yuichi ; et al.	2007-07-26
Method for manufacturing semiconductor device App 20070161211 - Sunohara; Masahiro ; et al.	2007-07-12
Method of manufacturing light emitting apparatus App 20070161316 - Taguchi; Yuichi ; et al.	2007-07-12
Light emitting device and manufacturing method thereof App 20070158674 - Taguchi; Yuichi ; et al.	2007-07-12
Semiconductor device and method for manufacturing the same App 20070145400 - Sunohara; Masahiro ; et al.	2007-06-28
Semicondcutor device and manufacturing method of semiconductor device App 20070145404 - Murayama; Kei ; et al.	2007-06-28
Wiring substrate and electronic parts packaging structure App 20070114673 - Murayama; Kei ; et al.	2007-05-24
Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device Grant 7,221,816 - Murayama May 22, 2	2007-05-22
Electronic parts packaging structure and method of manufacturing the same Grant 7,217,888 - Sunohara , et al. May 15, 2	2007-05-15
Wiring substrate and electronic parts packaging structure Grant 7,183,647 - Murayama , et al. February 27, 2	2007-02-27
Semiconductor Device And Electronic Apparatus App 20070013064 - Murayama; Kei ; et al.	2007-01-18
Electronic parts packaging structure and method of manufacturing the same App 20070013048 - Sunohara; Masahiro ; et al.	2007-01-18
Semiconductor Chip And Method Of Manufacturing The Same App 20070001312 - Murayama; Kei ; et al.	2007-01-04
Method of production of multilayer circuit board with built-in semiconductor chip Grant 7,134,195 - Sunohara , et al. November 14, 2	2006-11-14
Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate Grant 7,084,009 - Sunohara , et al. August 1, 2	2006-08-01
Electronic parts packaging structure and method of manufacturing the same Grant 7,084,006 - Sunohara , et al. August 1, 2	2006-08-01
Electronic parts packaging structure and method of manufacturing the same App 20060145359 - Sunohara; Masahiro ; et al.	2006-07-06
Method for producing semiconductor substrate App 20060141676 - Murayama; Kei ; et al.	2006-06-29
Stacked-type semiconductor device App 20060138623 - Murayama; Kei	2006-06-29
Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer Grant 7,067,353 - Koizumi , et al. June 27, 2	2006-06-27
Semiconductor inspection device and method for manufacturing contact probe Grant 7,061,261 - Murayama June 13, 2	2006-06-13
Electronic parts packaging structure and method of manufacturing the same Grant 7,057,290 - Sunohara , et al. June 6, 2	2006-06-06
Electronic parts packaging structure and method of manufacturing the same App 20060073639 - Sunohara; Masahiro ; et al.	2006-04-06
Electronic component embedded substrate and method for manufacturing the same App 20060021791 - Sunohara; Masahiro ; et al.	2006-02-02
Optical waveguide mounting member, substrate, semiconductor device, method of manufacturing optical waveguide mounting member, and method of manufacturing substrate App 20060018590 - Murayama; Kei	2006-01-26
Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device App 20060013525 - Murayama; Kei	2006-01-19
Method for manufacturing thin semiconductor chip Grant 6,974,721 - Koizumi , et al. December 13, 2	2005-12-13
Method for thinning wafer by grinding Grant 6,958,298 - Murayama October 25, 2	2005-10-25
Capacitor-mounted wiring board and method of manufacturing the same App 20050218502 - Sunohara, Masahiro ; et al.	2005-10-06
Electronic parts packaging structure and method of manufacturing the same App 20050211465 - Sunohara, Masahiro ; et al.	2005-09-29
Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film Grant 6,943,442 - Sunohara , et al. September 13, 2	2005-09-13
Electronic parts packaging structure and method of manufacturing the same Grant 6,930,392 - Sunohara , et al. August 16, 2	2005-08-16
Thin semiconductor chip manufacturing method App 20050176169 - Koizumi, Naoyuki ; et al.	2005-08-11
Semiconductor inspection device and method for manufacturing contact probe App 20050156614 - Murayama, Kei	2005-07-21
Electrical characteristic measuring probe and method of manufacturing the same App 20050110507 - Koizumi, Naoyuki ; et al.	2005-05-26
Patterning apparatus and film patterning method App 20050098099 - Murayama, Kei ; et al.	2005-05-12
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion Grant 6,864,120 - Murayama , et al. March 8, 2	2005-03-08
Semiconductor device and production method thereof Grant 6,861,284 - Higashi , et al. March 1, 2	2005-03-01
Electronic Parts Packaging Structure And Method Of Manufacturing The Same App 20050042801 - SUNOHARA, Masahiro ; et al.	2005-02-24
Inkjet printer App 20050024424 - Murayama, Kei	2005-02-03
Semiconductor device and production method thereof App 20040262735 - Higashi, Mitsutoshi ; et al.	2004-12-30
Semiconductor package Grant 6,835,597 - Murayama December 28, 2	2004-12-28
Method for manufacturing semiconductor package App 20040259351 - Koizumi, Naoyuki ; et al.	2004-12-23
Semiconductor device manufacturing method Grant 6,831,000 - Murayama December 14, 2	2004-12-14
Method for thinning wafer by grinding App 20040242003 - Murayama, Kei	2004-12-02
Electroless Plating Method App 20040213912 - MURAYAMA, Kei	2004-10-28
Wiring Substrate And Electronic Parts Packaging Structure App 20040212087 - MURAYAMA, Kei ; et al.	2004-10-28
Patterning Apparatus And Film Patterning Method App 20040209004 - MURAYAMA, Kei ; et al.	2004-10-21
Electronic Parts Packaging Structure And Method Of Manufacturing The Same App 20040209399 - SUNOHARA, Masahiro ; et al.	2004-10-21
Semiconductor package Grant 6,803,664 - Murayama October 12, 2	2004-10-12
Method of production of multilayer circuit board with built-in semiconductor chip App 20040188136 - Sunohara, Masahiro ; et al.	2004-09-30
Semiconductor device and method of production of same Grant 6,797,603 - Murayama , et al. September 28, 2	2004-09-28
Electronic parts packaging structure and method of manufacturing the same App 20040178510 - Sunohara, Masahiro ; et al.	2004-09-16
Semiconductor device App 20040173914 - Kurihara, Takashi ; et al.	2004-09-09
Semiconductor device fabrication method App 20040175903 - Sunohara, Masahiro ; et al.	2004-09-09
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion App 20040166609 - Murayama, Kei ; et al.	2004-08-26
Electronic parts packaging structure and method of manufacturing the same App 20040159933 - Sunohara, Masahiro ; et al.	2004-08-19
Semiconductor device manufacturing method App 20040137661 - Murayama, Kei	2004-07-15
Electronic parts packaging structure and method of manufacturing the same App 20040130013 - Sunohara, Masahiro ; et al.	2004-07-08
Electronic parts packaging structure and method of manufacturing the same App 20040113260 - Sunohara, Masahiro ; et al.	2004-06-17
Electronic parts packaging structure and method of manufacturing the same App 20040113261 - Sunohara, Masahiro ; et al.	2004-06-17
Inspection apparatus for semiconductor device and parts mounter using same Grant 6,738,504 - Higashi , et al. May 18, 2	2004-05-18
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion Grant 6,713,863 - Murayama , et al. March 30, 2	2004-03-30
Semiconductor package App 20040004293 - Murayama, Kei	2004-01-08
Semiconductor chip mounting apparatus and mounting method App 20040001140 - Murayama, Kei	2004-01-01
Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate App 20030102117 - Murayama, Kei ; et al.	2003-06-05
Semiconductor device and production method thereof App 20030102547 - Higashi, Mitsutoshi ; et al.	2003-06-05
Semiconductor device and process of producing same Grant 6,548,326 - Kobayashi , et al. April 15, 2	2003-04-15
Semiconductor device and method of production of same Grant 6,538,332 - Murayama , et al. March 25, 2	2003-03-25
Semiconductor device and method of production of same App 20030054590 - Murayama, Kei ; et al.	2003-03-20
Method and apparatus for measuring a bump on a substrate Grant 6,522,719 - Murayama , et al. February 18, 2	2003-02-18
Mounting structure for semiconductor devices Grant 6,522,022 - Murayama February 18, 2	2003-02-18
Semiconductor package App 20020158341 - Murayama, Kei	2002-10-31
Semiconductor element, connection structure thereof, semiconductor device using a plurality of such elements and processes for making the same App 20020145191 - Murayama, Kei ; et al.	2002-10-10
Mounting structure for semiconductor devices App 20020113303 - Murayama, Kei	2002-08-22
Semiconductor device Grant 6,404,070 - Higashi , et al. June 11, 2	2002-06-11
Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate App 20020062946 - Murayama, Kei ; et al.	2002-05-30
Semiconductor device and process of producing same App 20020041037 - Kobayashi, Tsuyoshi ; et al.	2002-04-11
Semiconductor device and method of production of same App 20020041033 - Murayama, Kei ; et al.	2002-04-11
Bump inspection apparatus and method App 20020018591 - Murayama, Kei ; et al.	2002-02-14
Semiconductor device to be mounted on main circuit board and process for manufacturing same device Grant 6,344,695 - Murayama February 5, 2	2002-02-05
Method and apparatus for measuring a bump on a substrate App 20010053197 - Murayama, Kei ; et al.	2001-12-20
Semiconductor device having a chip mounted on a rectangular substrate Grant 6,303,998 - Murayama October 16, 2	2001-10-16
Package structure for semiconductor chip Grant 6,281,592 - Murayama August 28, 2	2001-08-28
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion App 20010009302 - Murayama, Kei ; et al.	2001-07-26
Semiconductor device and production method thereof App 20010004130 - Higashi, Mitsutoshi ; et al.	2001-06-21
Semiconductor device and mount structure thereof Grant 5,777,386 - Higashi , et al. July 7, 1	1998-07-07
Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes Grant 5,736,780 - Murayama April 7, 1	1998-04-07

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