Murayama; Hitoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murayama; Hitoshi.The latest application filed is for "plasma treatment method and plasma treatment apparatus".

Company Profile

0.14.12

Murayama; Hitoshi - Shizuoka JP
Murayama; Hitoshi - Kyoto JP
Murayama; Hitoshi - Kyoto-fu JP
Murayama, Hitoshi - Shizuoka-ken JP
Murayama; Hitoshi - Soraku-gun JP
Murayama; Hitoshi - Souraku-gun JP
Murayama; Hitoshi - Soraku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plasma treatment method Grant 7,550,180 - Shirasuna , et al. June 23, 2	2009-06-23
Plasma Treatment Method And Plasma Treatment Apparatus App 20080271676 - Shirasuna; Toshiyasu ; et al.	2008-11-06
Vacuum processing apparatus in which high frequency powers having mutually different frequencies are used to generate plasma for processing an article Grant 7,051,671 - Aoki , et al. May 30, 2	2006-05-30
Deposited film forming apparatus and deposited film forming method Grant 6,946,167 - Hosoi , et al. September 20, 2	2005-09-20
Vacuum processing method and semiconductor device manufacturing method in which high-frequency powers having mutually different frequencies are applied to at least one electrode Grant 6,861,373 - Aoki , et al. March 1, 2	2005-03-01
Plasma processing method and method for manufacturing semiconductor device Grant 6,849,123 - Niino , et al. February 1, 2	2005-02-01
Vacuum processing method, vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device App 20040232415 - Aoki, Makoto ; et al.	2004-11-25
Plasma treatment apparatus Grant 6,761,128 - Shirasuna , et al. July 13, 2	2004-07-13
Plasma treatment method and plasma treatment apparatus App 20040112864 - Shirasuna, Toshiyasu ; et al.	2004-06-17
Deposited film forming apparatus and deposited film forming method App 20040083974 - Hosoi, Kazuto ; et al.	2004-05-06
Deposited film forming apparatus Grant 6,702,898 - Hosoi , et al. March 9, 2	2004-03-09
Vacuum processing method Grant 6,696,108 - Murayama , et al. February 24, 2	2004-02-24
Plasma processing apparatus Grant 6,649,020 - Okamura , et al. November 18, 2	2003-11-18
Plasma processing method and plasma processing apparatus App 20030196601 - Murayama, Hitoshi ; et al.	2003-10-23
Plasma processing method and method for manufacturing semiconductor device App 20030143821 - Niino, Hiroaki ; et al.	2003-07-31
Vacuum processing method, vacuum processing apparatus, semiconductor device manufacturing method and semiconductor device App 20030049558 - Aoki, Makoto ; et al.	2003-03-13
Vacuum processing method App 20020160124 - Murayama, Hitoshi ; et al.	2002-10-31
Plasma CVD apparatus and plasma processing method Grant 6,435,130 - Takaki , et al. August 20, 2	2002-08-20
Deposited film forming apparatus and deposited film forming method App 20020100421 - Hosoi, Kazuto ; et al.	2002-08-01
Apparatus and method for forming deposited film App 20020038630 - Otsuka, Takashi ; et al.	2002-04-04
Plasma treatment method and plasma treatment apparatus App 20020038632 - Shirasuna, Toshiyasu ; et al.	2002-04-04
Vacuum processing methods App 20020029818 - Murayama, Hitoshi ; et al.	2002-03-14
Vacuum processing apparatus and vacuum processing method Grant 6,250,251 - Akiyama , et al. June 26, 2	2001-06-26
Plasma processing apparatus and method Grant 6,165,274 - Akiyama , et al. December 26, 2	2000-12-26
Process for forming deposited film for light-receiving member, light-received member produced by the process deposited film forming apparatus, and method for cleaning deposited film forming apparatus Grant 5,817,181 - Okamura , et al. October 6, 1	1998-10-06
Process for forming deposited film for light-receiving member, light-receiving member produced by the process, deposited film forming apparatus, and method for cleaning deposited film forming apparatus Grant 5,455,138 - Okamura , et al. October 3, 1	1995-10-03

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