loadpatents
Patent applications and USPTO patent grants for Murata; Kensho.The latest application filed is for "lead-free solder".
Patent | Date |
---|---|
Lead-free solder Grant 7,282,175 - Amagai , et al. October 16, 2 | 2007-10-16 |
Lead-free solder alloy Grant 7,029,542 - Amagai , et al. April 18, 2 | 2006-04-18 |
Semiconductor chip mounting substrate and semiconductor device using it Grant 6,965,162 - Yoshino , et al. November 15, 2 | 2005-11-15 |
Semiconductor device and its manufacturing method Grant 6,929,971 - Murata , et al. August 16, 2 | 2005-08-16 |
Semiconductor device and its manufacturing method Grant 6,876,077 - Murata , et al. April 5, 2 | 2005-04-05 |
Lead-free solder App 20040262779 - Amagai, Masazumi ;   et al. | 2004-12-30 |
Semiconductor device and its manufacturing method App 20030155652 - Murata, Kensho ;   et al. | 2003-08-21 |
Semiconductor device and its manufacturing method App 20030107054 - Murata, Kensho ;   et al. | 2003-06-12 |
Semiconductor chip mounting substrate and semiconductor device using it App 20030039102 - Yoshino, Makoto ;   et al. | 2003-02-27 |
Semiconductor device and its manufacturing method App 20020145198 - Murata, Kensho ;   et al. | 2002-10-10 |
Semiconductor device and manufacturing method Grant 6,087,717 - Ano , et al. July 11, 2 | 2000-07-11 |
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