Muranaga; Masakazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Muranaga; Masakazu.The latest application filed is for "wireless module".
- Muranaga; Masakazu - Tokyo JP
- Muranaga; Masakazu - Yokohama JP
| Patent | Date |
|---|---|
| Wireless module Grant 10,916,827 - Maruyama , et al. February 9, 2 | 2021-02-09 |
| Wireless Module App 20190296417 - MARUYAMA; Kimihiro ; et al. | 2019-09-26 |
| Electronic component module, board, and method of manufacturing electronic component module Grant 9,572,264 - Yamamoto , et al. February 14, 2 | 2017-02-14 |
| Module board Grant 9,468,104 - Kakehashi , et al. October 11, 2 | 2016-10-11 |
| Electronic device Grant 9,437,553 - Muramatsu , et al. September 6, 2 | 2016-09-06 |
| Electronic Component Module, Board, And Method Of Manufacturing Electronic Component Module App 20150003023 - Yamamoto; Shinya ; et al. | 2015-01-01 |
| Electronic Device App 20140346653 - Muramatsu; Tohru ; et al. | 2014-11-27 |
| Module Board App 20140233191 - Kakehashi; Tatsuya ; et al. | 2014-08-21 |
| Electronic component and manufacturing method therefor Grant 8,199,527 - Muranaga June 12, 2 | 2012-06-12 |
| Card Module And Method For Manufacturing Card Module App 20120044625 - Muranaga; Masakazu ; et al. | 2012-02-23 |
| Electronic Component And Manufacturing Method Therefor App 20080292846 - MURANAGA; Masakazu | 2008-11-27 |
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