Murakami; Tomoyasu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murakami; Tomoyasu.The latest application filed is for "vapor-phase type heating method and vapor-phase type heating apparatus".

Company Profile

1.20.14

Murakami; Tomoyasu - Osaka JP
Murakami; Tomoyasu - Hiroshima JP
MURAKAMI; Tomoyasu - Hiroshima-shi JP
Murakami; Tomoyasu - Suita JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vapor-phase type heating method and vapor-phase type heating apparatus Grant 10,717,143 - Nagai , et al.	2020-07-21
Grommet and wire harness using the same Grant 10,651,640 - Murakami	2020-05-12
Bus bar and method of manufacturing bus bar Grant 10,305,203 - Murakami	2019-05-28
Protective tube attaching method Grant 10,211,613 - Kaneko , et al. Feb	2019-02-19
Vapor-phase Type Heating Method And Vapor-phase Type Heating Apparatus App 20180345397 - NAGAI; KOICHI ; et al.	2018-12-06
Electric connection box Grant 10,122,159 - Okada , et al. November 6, 2	2018-11-06
Bus Bar And Method Of Manufacturing Bus Bar App 20180316104 - MURAKAMI; Tomoyasu	2018-11-01
Electric Connection Box App 20170163016 - OKADA; Eiji ; et al.	2017-06-08
Protective Tube And Protective Tube Attaching Method App 20160248236 - Kaneko; Akihiko ; et al.	2016-08-25
Grommet And Wire Harness Using The Same App 20160036212 - MURAKAMI; Tomoyasu	2016-02-04
Dry etching method, fine structure formation method, mold and mold fabrication method Grant 7,919,005 - Nakagawa , et al. April 5, 2	2011-04-05
Dry etching method, fine structure formation method, mold and mold fabrication method Grant 7,906,030 - Nakagawa , et al. March 15, 2	2011-03-15
Dry etching method, fine structure formation method, mold and mold fabrication method Grant 7,758,761 - Nakagawa , et al. July 20, 2	2010-07-20
Dry etching method, fine structure formation method, mold and mold fabrication method Grant 7,731,862 - Nakagawa , et al. June 8, 2	2010-06-08
Wire harness water cut-off structure Grant 7,614,915 - Kamenoue , et al. November 10, 2	2009-11-10
Dry etching method, fine structure formation method, mold and mold fabrication method App 20090017259 - Nakagawa; Hideo ; et al.	2009-01-15
Dry etching method, fine structure formation method, mold and mold fabrication method App 20090011065 - Nakagawa; Hideo ; et al.	2009-01-08
Electric junction box Grant 7,347,733 - Murakami March 25, 2	2008-03-25
Wire Harness Water Cut-off Structure App 20080009175 - KAMENOUE; Masayoshi ; et al.	2008-01-10
Dry etching method, fine structure formation method, mold and mold fabrication method App 20070187359 - Nakagawa; Hideo ; et al.	2007-08-16
Dry etching method, fine structure formation method, mold and mold fabrication method App 20070187362 - Nakagawa; Hideo ; et al.	2007-08-16
Anaerobic adhesive compositions and water-blocking treatment of electrical wires with the same compositions App 20070093575 - Murakami; Tomoyasu ; et al.	2007-04-26
Electric junction box App 20070091547 - Murakami; Tomoyasu	2007-04-26
Grommet Grant 7,189,930 - Murakami March 13, 2	2007-03-13
Harness holder and harness layout structure thereby Grant 7,109,421 - Sekino , et al. September 19, 2	2006-09-19
Grommet App 20060201710 - Murakami; Tomoyasu	2006-09-14
Harness holder and harness layout structure thereby App 20050092511 - Sekino, Tsukasa ; et al.	2005-05-05
Polishing pad for semiconductor wafer and method for polishing semiconductor wafer Grant 6,099,390 - Nishio , et al. August 8, 2	2000-08-08
Apparatus for holding substrate to be polished Grant 6,074,289 - Murakami , et al. June 13, 2	2000-06-13
Polishing method and polishing apparatus Grant 6,012,967 - Satake , et al. January 11, 2	2000-01-11
Method and apparatus for polishing semiconductor substrate Grant 5,866,480 - Murakami , et al. February 2, 1	1999-02-02
Method of preventing diffusion between interconnect and plug Grant 5,834,369 - Murakami , et al. November 10, 1	1998-11-10
Locking structure Grant 5,709,249 - Okada , et al. January 20, 1	1998-01-20
Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture Grant 5,576,247 - Yano , et al. November 19, 1	1996-11-19

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