Murakami; Gen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Murakami; Gen.The latest application filed is for "light emitting device and process for manufacturing the same".
Company Profile
0.52.12
- Murakami; Gen - Tokyo JP
- Murakami; Gen - Machida JP
- Murakami; Gen - Tama JP
- Murakami; Gen - Ibaraki JP
- Murakami; Gen - Malhida JP
- Murakami; Gen - Kodiara JA
- Murakami; Gen - Kodaira JA
Patent Activity
| Patent | Date |
|---|---|
| Light emitting device having a mirror portion Grant 7,476,913 - Isobe , et al. January 13, 2 | 2009-01-13 |
| Light Emitting Device and Process for Manufacturing the Same App 20080128724 - Isobe; Hiroyuki ; et al. | 2008-06-05 |
| Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit Grant 7,317,181 - Murakami , et al. January 8, 2 | 2008-01-08 |
| Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit App 20060054912 - Murakami; Gen ; et al. | 2006-03-16 |
| Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit Grant 6,995,510 - Murakami , et al. February 7, 2 | 2006-02-07 |
| Surface package type semiconductor package and method of producing semiconductor memory Grant 6,981,585 - Kitamura , et al. January 3, 2 | 2006-01-03 |
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Wiring board, semiconductor device, electronic device, and circuit board for electronic parts Grant 6,855,893 - Kumakura , et al. February 15, 2 | 2005-02-15 |
| Wiring board, semiconductor device, electronic device, and circuit board for electronic parts App 20040211591 - Kumakura, Toyohiko ; et al. | 2004-10-28 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit App 20030107316 - Murakami, Gen ; et al. | 2003-06-12 |
| Surface package type semiconductor package and method of producing semiconductor memory App 20030057113 - Kitamura, Wahei ; et al. | 2003-03-27 |
| Surface package type semiconductor package and method of producing semiconductor memory App 20020179460 - Kitamura, Wahei ; et al. | 2002-12-05 |
| Surface package type semiconductor package and method of producing semiconductor memory App 20020174627 - Kitamura, Wahei ; et al. | 2002-11-28 |
| Sealed stacked arrangement of semiconductor devices Grant RE37,539 - Oguchi , et al. February 5, 2 | 2002-02-05 |
| Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy Grant 6,297,142 - Mita , et al. October 2, 2 | 2001-10-02 |
| Surface package type semiconductor package and method of producing semiconductor memory App 20010015327 - Kitamura, Wahei ; et al. | 2001-08-23 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same App 20010002066 - Mita, Mamoru ; et al. | 2001-05-31 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Semiconductor device, interposer for semiconductor device Grant 6,031,292 - Murakami , et al. February 29, 2 | 2000-02-29 |
| Semiconductor device having lead on chip structure Grant 6,002,167 - Hatano , et al. December 14, 1 | 1999-12-14 |
| Interposer for semiconductor device Grant 5,866,948 - Murakami , et al. February 2, 1 | 1999-02-02 |
| Semiconductor device Grant 5,714,405 - Tsubosaki , et al. February 3, 1 | 1998-02-03 |
| Sealed stacked arrangement of semiconductor devices Grant 5,701,031 - Oguchi , et al. December 23, 1 | 1997-12-23 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Surface package type semiconductor package and method of producing semiconductor memory Grant 5,607,059 - Kitamura , et al. March 4, 1 | 1997-03-04 |
| Semiconductor device with lead structure within the planar area of the device Grant 5,583,375 - Tsubosaki , et al. December 10, 1 | 1996-12-10 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation Grant 5,442,233 - Anjoh , et al. August 15, 1 | 1995-08-15 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Plastic encapsulated semiconductor device and lead frame Grant 5,357,139 - Yaguchi , et al. October 18, 1 | 1994-10-18 |
| Multi-chip semiconductor package Grant 5,332,922 - Oguchi , et al. July 26, 1 | 1994-07-26 |
| Semiconductor device and method of producing the same Grant 5,304,844 - Horiuchi , et al. * April 19, 1 | 1994-04-19 |
| Semiconductor device with a plurality of face to face chips Grant 5,296,737 - Nishimura , et al. March 22, 1 | 1994-03-22 |
| Method of producing semiconductor memory Grant 5,295,297 - Kitamura , et al. March 22, 1 | 1994-03-22 |
| Method of producing surface package type semiconductor package Grant 5,274,914 - Kitamura , et al. January 4, 1 | 1994-01-04 |
| Plastic encapsulated semiconductor device Grant 5,256,903 - Obata , et al. October 26, 1 | 1993-10-26 |
| Semiconductor device Grant 5,235,207 - Ohi , et al. August 10, 1 | 1993-08-10 |
| Semiconductor device Grant 5,184,208 - Sakuta , et al. February 2, 1 | 1993-02-02 |
| Resin-encapsulated semiconductor device having a particular mounting structure Grant 5,150,193 - Yasuhara , et al. September 22, 1 | 1992-09-22 |
| Method of producing semiconductor memory packages Grant 5,095,626 - Kitamura , et al. March 17, 1 | 1992-03-17 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
| Semiconductor device and method of producing the same Grant 5,032,895 - Horiuchi , et al. July 16, 1 | 1991-07-16 |
| Process of producing semiconductor device Grant 4,994,411 - Naito , et al. February 19, 1 | 1991-02-19 |
| Semiconductor device and method of manufacturing the same Grant 4,989,068 - Yasuhara , et al. January 29, 1 | 1991-01-29 |
| Semiconductor device and method of manufacturing the same Grant 4,987,474 - Yasuhara , et al. January 22, 1 | 1991-01-22 |
| Surface package type semiconductor package Grant 4,971,196 - Kitamura , et al. November 20, 1 | 1990-11-20 |
| Resin-encapsulated semiconductor device Grant 4,951,122 - Tsubosaki , et al. August 21, 1 | 1990-08-21 |
| Semiconductor device and method of manufacturing thereof Grant 4,707,724 - Suzuki , et al. November 17, 1 | 1987-11-17 |
| Semiconductor device and method of producing the same Grant 4,706,105 - Masuda , et al. November 10, 1 | 1987-11-10 |
| Semiconductor device and a method of producing the same Grant 4,691,225 - Murakami , et al. September 1, 1 | 1987-09-01 |
| Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member Grant 4,301,464 - Otsuki , et al. November 17, 1 | 1981-11-17 |
| Semiconductor Grant D260,986 - Mochizuki , et al. September 29, 1 | 1981-09-29 |
| Semiconductor Grant D260,091 - Mochizuki , et al. August 4, 1 | 1981-08-04 |
| Semiconductor Grant D259,782 - Mochizuki , et al. July 7, 1 | 1981-07-07 |
| Semiconductor Grant D259,783 - Mochizuki , et al. July 7, 1 | 1981-07-07 |
| Semiconductor Grant D259,560 - Mochizuki , et al. June 16, 1 | 1981-06-16 |
| Multiple-digit Display Device And Method Of Manufacturing The Same Grant 3,873,171 - Miyamoto , et al. March 25, 1 | 1975-03-25 |
| Multiple Digit Display Device And Method Of Manufacturing Same Grant 3,873,169 - Miyamoto , et al. March 25, 1 | 1975-03-25 |
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