Murai; Tadashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Murai; Tadashi.The latest application filed is for "printed board and manufacturing method thereof".
- Murai; Tadashi - Kanagawa JP
| Patent | Date |
|---|---|
| Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns Grant 7,378,745 - Hayashi , et al. May 27, 2 | 2008-05-27 |
| Printed circuit board having colored outer layer Grant 7,323,238 - Kondo , et al. January 29, 2 | 2008-01-29 |
| Printed board and manufacturing method thereof App 20060068180 - Kondo; Koji ; et al. | 2006-03-30 |
| Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device App 20060044735 - Hayashi; Akimori ; et al. | 2006-03-02 |
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