MURAI; Akihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for MURAI; Akihiko.The latest application filed is for "nitride semiconductor light emitting device".

Company Profile

0.19.18

MURAI; Akihiko - Osaka JP
Murai; Akihiko - Pittsburgh PA US
Murai; Akihiko - Yao JP
Murai; Akihiko - Kagoshima N/A JP
Murai; Akihiko - Hioki N/A JP
Murai; Akihiko - Hioki Kogoshima N/A JP
Murai; Akihiko - Goleta CA
Murai; Akihiko - Hioki Kagoshima JP
Murai; Akihiko - Goletz CA
Murai; Akihiko - Yao-shi JP
Murai; Akihiko - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nitride Semiconductor Light Emitting Device App 20180076355 - HAYASHI; Shintaro ; et al.	2018-03-15
Semiconductor Device App 20170294559 - GOTO; Koji ; et al.	2017-10-12
Robot action based on human demonstration Grant 9,162,720 - Mistry , et al. October 20, 2	2015-10-20
Light emitting device Grant 9,018,656 - Murai , et al. April 28, 2	2015-04-28
Light distribution controller, light-emitting device using the same, and method for fabricating light distribution controller Grant 8,669,571 - Murai , et al. March 11, 2	2014-03-11
Semiconductor light emitting device including anode and cathode having the same metal structure Grant 8,536,585 - Murai September 17, 2	2013-09-17
Semiconductor light emitting element and illuminating apparatus using the same Grant 8,525,204 - Fukshima , et al. September 3, 2	2013-09-03
Light emitting device Grant 8,410,471 - Murai April 2, 2	2013-04-02
Light Distribution Controller, Light-emitting Device Using The Same, And Method For Fabricating Light Distribution Controller App 20130075776 - Murai; Akihiko ; et al.	2013-03-28
Semiconductor light-emitting element, method of manufacturing same, and light-emitting device Grant 8,395,173 - Murai , et al. March 12, 2	2013-03-12
Robotic Controller That Realizes Human-like Responses To Unexpected Disturbances App 20130054021 - MURAI; AKIHIKO ; et al.	2013-02-28
Method for fabricating a direct wafer bonded optoelectronic device Grant 8,334,151 - Murai , et al. December 18, 2	2012-12-18
Robot Action Based On Human Demonstration App 20120143374 - MISTRY; Michael ; et al.	2012-06-07
Light Emitting Device App 20110297989 - Murai; Akihiko ; et al.	2011-12-08
Light Emitting Device App 20110248239 - Murai; Akihiko	2011-10-13
Semiconductor Light-emitting Element, Method Of Manufacturing Same, And Light-emitting Device App 20110215296 - Murai; Akihiko ; et al.	2011-09-08
Semi-conductor Light Emitting Device App 20110198668 - Murai; Akihiko	2011-08-18
High light extraction efficiency light emitting diode (LED) Grant 7,994,527 - DenBaars , et al. August 9, 2	2011-08-09
Semiconductor Light Emitting Element And Illuminating Apparatus Using The Same App 20110018024 - Fukshima; Hiroshi ; et al.	2011-01-27
High Light Extraction Efficiency Light Emitting Diode (led) Through Multiple Extractors App 20100289043 - Aurelien; David J. F. ; et al.	2010-11-18
(Al,Ga,In)N AND ZnO DIRECT WAFER BONDED STRUCTURE FOR OPTOELECTRONIC APPLICATIONS, AND ITS FABRICATION METHOD App 20100187555 - Murai; Akihiko ; et al.	2010-07-29
(Al,Ga,In)N and ZnO direct wafer bonded structure for optoelectronic applications, and its fabrication method Grant 7,719,020 - Murai , et al. May 18, 2	2010-05-18
Method for wafer bonding (A1, In, Ga)N and Zn(S, Se) for optoelectronic applications Grant 7,344,958 - Murai , et al. March 18, 2	2008-03-18
Muscular strength acquiring method and device based on musculoskeletal model Grant 7,308,826 - Nakamura , et al. December 18, 2	2007-12-18
Muscular Strength Acquiring Method and Device Based on Musculoskeletal Model App 20070256494 - Nakamura; Yoshihiko ; et al.	2007-11-08
High light extraction efficiency light emitting diode (LED) App 20070102721 - DenBaars; Steven P. ; et al.	2007-05-10
(Al, Ga, In)N and ZnO direct wafer bonded structure for optoelectronic applications, and its fabrication method App 20070001186 - Murai; Akihiko ; et al.	2007-01-04
Method for wafer bonding (Al, In, Ga)N and Zn(S, Se) for optoelectronic applications App 20060009006 - Murai; Akihiko ; et al.	2006-01-12

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