Murage; Yoshimi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murage; Yoshimi.The latest application filed is for "non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor".

Company Profile

0.8.6

Murage; Yoshimi - Hofu N/A JP
Murage; Yoshimi - Hofu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Grant 8,411,415 - Yoshinaga , et al. April 2, 2	2013-04-02
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Grant 8,409,756 - Yoshinaga , et al. April 2, 2	2013-04-02
Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquid Grant 8,362,187 - Yoshinaga , et al. January 29, 2	2013-01-29
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Grant 8,293,860 - Yoshinaga , et al. October 23, 2	2012-10-23
Non-thermofusible Phenol Resin Powder, Method For Producing The Same, Thermosetting Resin Composition, Sealing Material For Semiconductor, And Adhesive For Semiconductor App 20120237830 - YOSHINAGA; Naoto ; et al.	2012-09-20
Non-thermofusible Phenol Resin Powder, Method For Producing The Same, Thermosetting Resin Composition, Sealing Material For Semiconductor, And Adhesive For Semiconductor App 20120135238 - Yoshinaga; Naoto ; et al.	2012-05-31
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor Grant 8,158,095 - Yoshinaga , et al. April 17, 2	2012-04-17
Phenol Resin Powder, Method For Producing The Same, And Phenol Resin Powder Dispersion Liquid App 20100086782 - Yoshinaga; Naoto ; et al.	2010-04-08
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor App 20100075228 - Yoshinaga; Naoto ; et al.	2010-03-25
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor App 20100074831 - Yoshinaga; Naoto ; et al.	2010-03-25
Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor App 20100004356 - Yoshinaga; Naoto ; et al.	2010-01-07

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