MUNDIYATH; Shamal

Patent Applications and Registrations

Patent applications and USPTO patent grants for MUNDIYATH; Shamal.The latest application filed is for "short interconnect assembly with strip elastomer".

Company Profile

12.17.21

MUNDIYATH; Shamal - Petaling Jaya MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Short Interconnect Assembly With Strip Elastomer App 20220151063 - FOONG; Wei Kuong ; et al.	2022-05-12
Short interconnect assembly with strip elastomer Grant 11,266,015 - Foong , et al. March 1, 2	2022-03-01
Short Interconnect Assembly With Strip Elastomer App 20210392746 - FOONG; Wei Kuong ; et al.	2021-12-16
Wedged Contact Fingers For Integrated Circuit Testing Apparatus App 20200393511 - FOONG; Wei Kuong ; et al.	2020-12-17
Low inductance electrical contact assembly manufacturing process Grant 10,830,812 - Foong , et al. November 10, 2	2020-11-10
Horizontal clamp electrical contact assembly Grant 10,826,217 - Foong , et al. November 3, 2	2020-11-03
Short contact with multifunctional elastomer Grant 10,578,645 - Foong , et al.	2020-03-03
Short Contact With Multifunctional Elastomer App 20200064371 - FOONG; Wei Kuong ; et al.	2020-02-27
Kelvin contact assembly and method of installation thereof Grant 10,527,646 - Foong , et al. J	2020-01-07
Compressible layer with integrated bridge in IC testing apparatus Grant 10,488,439 - Foong , et al. Nov	2019-11-26
High precision vertical motion kelvin contact assembly Grant 10,466,300 - Foong , et al. No	2019-11-05
Spring contact in a testing apparatus for integrated circuits Grant 10,446,965 - Foong , et al. Oc	2019-10-15
Horizontal Clamp Electrical Contact Assembly App 20190267738 - FOONG; Wei Kuong ; et al.	2019-08-29
Low Inductance Electrical Contact Assembly Manufacturing Process App 20190064260 - FOONG; Wei Kuong ; et al.	2019-02-28
Low Inductance Electrical Contact Assembly App 20190067861 - FOONG; Wei Kuong ; et al.	2019-02-28
Manufacturing Process For Kelvin Contact Assembly Housing App 20180337505 - FOONG; Wei Kuong ; et al.	2018-11-22
High Precision Vertical Motion Kelvin Contact Assembly App 20180335473 - FOONG; Wei Kuong ; et al.	2018-11-22
Compressible Layer With Integrated Bridge In Ic Testing Apparatus App 20180328963 - FOONG; Wei Kuong ; et al.	2018-11-15
Short Contact With Multifunctional Elastomer App 20180313869 - FOONG; Wei Kuong ; et al.	2018-11-01
Compressible layer with integrated bridge in IC testing apparatus Grant 10,031,163 - Foong , et al. July 24, 2	2018-07-24
Kelvin contact assembly in a testing apparatus for integrated circuits Grant 10,018,653 - Foong , et al. July 10, 2	2018-07-10
Short contact in a testing apparatus for wireless integrated circuits Grant 10,018,652 - Foong , et al. July 10, 2	2018-07-10
Spring Contact In A Testing Apparatus For Integrated Circuits App 20170244189 - FOONG; Wei Kuong ; et al.	2017-08-24
Kelvin Contact Assembly And Method Of Installation Thereof App 20170242055 - FOONG; Wei Kuong ; et al.	2017-08-24
Kelvin Contact Assembly In A Testing Apparatus For Integrated Circuits App 20170219624 - FOONG; Wei Kuong ; et al.	2017-08-03
Contact assembly in a testing apparatus for integrated circuits Grant 9,658,253 - Foong , et al. May 23, 2	2017-05-23
Ground contact of an integrated circuit testing apparatus Grant 9,658,248 - Kuong , et al. May 23, 2	2017-05-23
Contact Assembly In A Testing Apparatus For Integrated Circuits App 20160178692 - FOONG; Wei Kuong ; et al.	2016-06-23
Short Contact In A Testing Apparatus For Wireless Integrated Circuits App 20160079707 - FOONG; Wei Kuong ; et al.	2016-03-17
Multiple rigid contact solution for IC testing Grant 9,182,424 - Kuong , et al. November 10, 2	2015-11-10
Electrical interconnect assembly Grant 9,140,721 - Foong , et al. September 22, 2	2015-09-22
Electrical Interconnect Assembly App 20150212111 - FOONG; Wei Kuong ; et al.	2015-07-30
Compressible Layer With Integrated Bridge In Ic Testing Apparatus App 20150168451 - FOONG; Wei Kuong ; et al.	2015-06-18
Electrical interconnect assembly Grant 8,952,714 - Foong , et al. February 10, 2	2015-02-10
Electrical Interconnect Assembly App 20140127953 - Foong; Wei Kuong ; et al.	2014-05-08
Ground Contact Of An Integrated Circuit Testing Apparatus App 20140103952 - KUONG; Foong Wei ; et al.	2014-04-17
Multiple Rigid Contact Solution For Ic Testing App 20130249583 - KUONG; Foong Wei ; et al.	2013-09-26

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