Mun; SeongHun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mun; SeongHun.The latest application filed is for "semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages".

Company Profile

0.13.6

Mun; SeongHun - Bucheon-si N/A KR
Mun; SeongHun - Incheon KR
Mun; SeongHun - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interposer substrate designs for semiconductor packages Grant 9,905,491 - Yoon , et al. February 27, 2	2018-02-27
Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 9,748,203 - Yang , et al. August 29, 2	2017-08-29
Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages Grant 9,331,007 - Yoon , et al. May 3, 2	2016-05-03
Methods of mitigating defects for semiconductor packages Grant 9,184,067 - Kim , et al. November 10, 2	2015-11-10
Integrated circuit packaging system with interposer shield and method of manufacture thereof Grant 8,779,562 - Lee , et al. July 15, 2	2014-07-15
Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages App 20140103509 - Yoon; Insang ; et al.	2014-04-17
Integrated circuit packaging system with encapsulation and method of manufacture thereof Grant 8,643,181 - Bae , et al. February 4, 2	2014-02-04
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20130154092 - Yang; DeokKyung ; et al.	2013-06-20
Integrated circuit packaging system with stacking option and method of manufacture thereof Grant 8,378,476 - Lee , et al. February 19, 2	2013-02-19
Integrated Circuit Packaging System With Interposer Shield And Method Of Manufacture Thereof App 20120241921 - Lee; SeongMin ; et al.	2012-09-27
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110233751 - Bae; JoHyun ; et al.	2011-09-29
Integrated Circuit Packaging System With Stacking Option And Method Of Manufacture Thereof App 20110233747 - Lee; SeongMin ; et al.	2011-09-29

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