Muller-Hipper; Andreas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Muller-Hipper; Andreas.The latest application filed is for "metal foam".

Company Profile

0.6.13

Muller-Hipper; Andreas - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Module for contactless chip cards or identification systems Grant 7,451,936 - Puschner , et al. November 18, 2	2008-11-18
Chip card Grant 7,240,847 - Puschner , et al. July 10, 2	2007-07-10
Metal Foam App 20070099020 - KARL; ANDREAS ; et al.	2007-05-03
Process For Producing A Structured Metal Layer On A Substrate Body App 20070082127 - Gundlach; Harald ; et al.	2007-04-12
Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam Grant 7,192,509 - Karl , et al. March 20, 2	2007-03-20
Module for contactless chip cards or identification systems App 20060243812 - Puschner; Frank ; et al.	2006-11-02
Module for contactless chip cards or identification systems Grant 7,100,836 - Puschner , et al. September 5, 2	2006-09-05
Chip card module App 20060043200 - Puschner; Frank ; et al.	2006-03-02
Chip module App 20060043575 - Muller-Hipper; Andreas ; et al.	2006-03-02
Process for producing a metal layer on a substrate body, and substrate body having a metal layer Grant 6,984,446 - Gundlach , et al. January 10, 2	2006-01-10
Method and system for producing conductive patterns on a substrate App 20050272249 - Karl, Andreas ; et al.	2005-12-08
Contactless data storage medium Grant 6,946,958 - Gundlach , et al. September 20, 2	2005-09-20
Chip card App 20050199734 - Puschner, Frank ; et al.	2005-09-15
Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam App 20050194259 - Karl, Andreas ; et al.	2005-09-08
Module for contactless chip cards or identification systems App 20050116051 - Puschner, Frank ; et al.	2005-06-02
Electrodeposition device and electrodeposition system for coating structures which have already been made conductive App 20050061661 - Muller-Hipper, Andreas ; et al.	2005-03-24
Process for producing a metal layer on a substrate body, and substrate body having a metal layer App 20050052326 - Gundlach, Harald ; et al.	2005-03-10
Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer App 20050034995 - Gundlach, Harald ; et al.	2005-02-17
Contactless data storage medium App 20040074975 - Gundlach, Harald ; et al.	2004-04-22

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