Mule'; Tony

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mule'; Tony.The latest application filed is for "systems and methods for three-dimensional lithography and nano-indentation".

Company Profile

0.7.9

Mule'; Tony - Atlanta GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Grant 7,554,347 - Mule' , et al. June 30, 2	2009-06-30
Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof Grant 7,016,569 - Mule , et al. March 21, 2	2006-03-21
Systems and methods for three-dimensional lithography and nano-indentation App 20050257709 - Mule, Tony ; et al.	2005-11-24
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Grant 6,954,576 - Mule' , et al. October 11, 2	2005-10-11
Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof Grant 6,947,651 - September 20, 2	2005-09-20
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package App 20040264840 - Mule, Tony ; et al.	2004-12-30
Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof Grant 6,807,352 - October 19, 2	2004-10-19
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication Grant 6,788,867 - Mule' , et al. September 7, 2	2004-09-07
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Grant 6,785,458 - Mule' , et al. August 31, 2	2004-08-31
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication App 20040126076 - Mule, Tony ; et al.	2004-07-01
Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof App 20040071387 - Mule, Tony ; et al.	2004-04-15
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use App 20040017215 - Mule, Tony ; et al.	2004-01-29
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication App 20030012539 - Mule', Tony ; et al.	2003-01-16
Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof App 20020186950 - Mule', Tony ; et al.	2002-12-12
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package App 20020136481 - Mule', Tony ; et al.	2002-09-26
Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof App 20020122648 - Mule', Tony ; et al.	2002-09-05

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