Mukherjee; Sutapa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mukherjee; Sutapa.The latest application filed is for "sintering powder".
- Mukherjee; Sutapa - Bangalore IN
- Mukherjee; Sutapa - South Plainfield NJ
- Mukherjee; Sutapa - Waterbury CT
| Patent | Date |
|---|---|
| Sintering materials and attachment methods using same Grant 11,389,865 - Ghoshal , et al. July 19, 2 | 2022-07-19 |
| Sintering Powder App 20220169905 - Ghosal; Shamik ; et al. | 2022-06-02 |
| Sintering paste Grant 11,162,007 - Ghosal , et al. November 2, 2 | 2021-11-02 |
| Lead-free and antimony-free tin solder reliable at high temperatures Grant 11,090,768 - Choudhury , et al. August 17, 2 | 2021-08-17 |
| Multilayered Metal Nano And Micron Particles App 20210205935 - Ghoshal; Shamik ; et al. | 2021-07-08 |
| Multilayered metal nano and micron particles Grant 10,894,302 - Ghoshal , et al. January 19, 2 | 2021-01-19 |
| Engineered polymer-based electronic materials Grant 10,682,732 - Venkatagiriyappa , et al. | 2020-06-16 |
| Sintering Powder App 20190194517 - Ghosal; Shamik ; et al. | 2019-06-27 |
| Low temperature high reliability alloy for solder hierarchy Grant 10,322,471 - Choudhury , et al. | 2019-06-18 |
| Engineered Polymer-Based Electronic Materials App 20190143461 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2019-05-16 |
| Sintering powder Grant 10,259,980 - Ghosal , et al. | 2019-04-16 |
| Method for manufacturing metal powder Grant 10,130,995 - Chaki , et al. November 20, 2 | 2018-11-20 |
| Engineered Polymer-Based Electronic Materials App 20180056455 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2018-03-01 |
| Dual-side reinforcement flux for encapsulation Grant 9,786,629 - Venkatagiriyappa , et al. October 10, 2 | 2017-10-10 |
| Low Temperature High Reliability Alloy for Solder Hierarchy App 20170197281 - Choudhury; Pritha ; et al. | 2017-07-13 |
| Sintering Materials and Attachment Methods Using Same App 20170144221 - GHOSHAL; Shamik ; et al. | 2017-05-25 |
| Engineered Residue Solder Paste Technology App 20170135227 - Ramakrishna; Hosur Venkatagiriyappa ; et al. | 2017-05-11 |
| Multilayered Metal Nano and Micron Particles App 20170113306 - Ghoshal; Shamik ; et al. | 2017-04-27 |
| Method for Manufacturing Metal Powder App 20170028477 - Setna; Rohan P. ; et al. | 2017-02-02 |
| Dual-side Reinforcement Flux For Encapsulation App 20160163672 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2016-06-09 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ; et al. | 2016-01-28 |
| Sintering Powder App 20150353804 - Ghosal; Shamik ; et al. | 2015-12-10 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ; et al. | 2015-09-24 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ; et al. | 2015-08-13 |
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