Mukaiyama; Yoshitaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mukaiyama; Yoshitaka.The latest application filed is for "substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate".

Company Profile

7.14.20

Mukaiyama; Yoshitaka - Tokyo JP
Mukaiyama; Yoshitaka - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate Grant 11,384,447 - Miyamoto , et al. July 12, 2	2022-07-12
Substrate Holder, Plating Apparatus, Method For Manufacturing Substrate Holder, And Method For Holding Substrate App 20210277534 - MIYAMOTO; Matsutaro ; et al.	2021-09-09
Paddle, Processing Apparatus Having The Paddle, And Method Of Producing The Paddle App 20210262111 - Masuda; Yasuyuki ; et al.	2021-08-26
Plating apparatus and plating method Grant 11,047,063 - Fujikata , et al. June 29, 2	2021-06-29
Substrate holder and plating apparatus Grant 11,015,261 - Mukaiyama , et al. May 25, 2	2021-05-25
Substrate-holder Inspection Apparatus, Plating Apparatus Including The Same, And Appearance Inspection Apparatus App 20200255968 - MUKAIYAMA; Yoshitaka ; et al.	2020-08-13
Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device Grant 10,665,495 - Yokoyama , et al.	2020-05-26
Plating apparatus and plating method Grant 10,577,714 - Mukaiyama , et al.	2020-03-03
Plating Apparatus And Plating Method App 20190226114 - FUJIKATA; Jumpei ; et al.	2019-07-25
Plating apparatus and plating method Grant 10,294,578 - Fujikata , et al.	2019-05-21
Substrate Holder And Plating Apparatus App 20190084777 - MUKAIYAMA; Yoshitaka ; et al.	2019-03-21
Substrate Attachment/detachment Device, Plating Device, Control Device For A Substrate Attachment/detachment Device, And Storage Medium That Stores A Program For Causing A Computer To Execute A Method Of Controlling A Substrate Attachment/detachment Device App 20180182659 - YOKOYAMA; Toshio ; et al.	2018-06-28
Plating Apparatus And Plating Method App 20170298531 - MUKAIYAMA; Yoshitaka ; et al.	2017-10-19
Apparatus And Method For Supplying Plating Solution To Plating Tank, Plating System, Powder Container, And Plating Method App 20170226656 - DOU; Chunhui ; et al.	2017-08-10
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 9,714,476 - Yoshioka , et al. July 25, 2	2017-07-25
Plating Apparatus And Plating Method App 20160145760 - FUJIKATA; Jumpei ; et al.	2016-05-26
Method Of Operating An Electroless Plating Apparatus App 20160130702 - NAKAGAWA; Yoichi ; et al.	2016-05-12
Semiconductor Wafer Holder And Electroplating System For Plating A Semiconductor Wafer App 20150122635 - YOSHIOKA; Junichiro ; et al.	2015-05-07
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 8,961,755 - Yoshioka , et al. February 24, 2	2015-02-24
Wet Processing Apparatus And Plating Apparatus App 20150013905 - NAKAGAWA; Yoichi ; et al.	2015-01-15
Semiconductor Wafer Holder And Electroplating System For Plating A Semiconductor Wafer App 20120048727 - Yoshioka; Junichiro ; et al.	2012-03-01
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 8,075,756 - Yoshioka , et al. December 13, 2	2011-12-13
Plating apparatus and method Grant 8,012,332 - Yoshioka , et al. September 6, 2	2011-09-06
Semiconductor Wafer Holder And Electroplating System For Plating A Semiconductor Wafer App 20110036722 - Yoshioka; Junichiro ; et al.	2011-02-17
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 7,833,393 - Yoshioka , et al. November 16, 2	2010-11-16
Plating Apparatus And Method App 20080245669 - Yoshioka; Junichiro ; et al.	2008-10-09
Plating apparatus and method Grant 7,402,227 - Yoshioka , et al. July 22, 2	2008-07-22
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer App 20060151317 - Yoshioka; Junichiro ; et al.	2006-07-13
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 7,022,211 - Yoshioka , et al. April 4, 2	2006-04-04
Plating apparatus and method App 20050082163 - Yoshioka, Junichiro ; et al.	2005-04-21
Electrolytic solution supply and recovery facility and liquid component replenishment apparatus App 20040256221 - Mishima, Koji ; et al.	2004-12-23
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer App 20020029963 - Yoshioka, Junichiro ; et al.	2002-03-14
Plating apparatus and method App 20020027080 - Yoshioka, Junichiro ; et al.	2002-03-07

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