loadpatents
name:-0.017510175704956
name:-0.015458106994629
name:-0.0012750625610352
Mugiya; Eiji Patent Filings

Mugiya; Eiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mugiya; Eiji.The latest application filed is for "circuit module and method of manufacturing same".

Company Profile
0.13.17
  • Mugiya; Eiji - Tokyo JP
  • MUGIYA; Eiji - Takasaki-shi JP
  • Mugiya; Eiji - Takasaki JP
  • Mugiya; Eiji - Gunma JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Circuit module and method of producing the same
Grant 9,807,916 - Kitazaki , et al. October 31, 2
2017-10-31
Circuit module and method of manufacturing same
Grant 9,560,740 - Kitazaki , et al. January 31, 2
2017-01-31
Circuit module and method of producing circuit module
Grant 9,456,488 - Shimamura , et al. September 27, 2
2016-09-27
Circuit module and production method therefor
Grant 9,455,209 - Mugiya , et al. September 27, 2
2016-09-27
Circuit Module And Method Of Manufacturing Same
App 20160095267 - KITAZAKI; Kenzo ;   et al.
2016-03-31
Circuit module having electrical shield
Grant 9,101,050 - Shimamura , et al. August 4, 2
2015-08-04
Circuit module and method of producing the same
Grant 9,101,044 - Shimamura , et al. August 4, 2
2015-08-04
Circuit module
Grant 9,055,682 - Mugiya , et al. June 9, 2
2015-06-09
Circuit module and method of producing circuit module
Grant 9,018,039 - Mugiya , et al. April 28, 2
2015-04-28
Circuit Module And Method Of Producing Circuit Module
App 20150070849 - SHIMAMURA; Masaya ;   et al.
2015-03-12
Circuit Module And Method Of Producing The Same
App 20150070851 - KITAZAKI; Kenzo ;   et al.
2015-03-12
Circuit Module
App 20150062835 - KAI; Takehiko ;   et al.
2015-03-05
Circuit Module
App 20150049439 - SHIMAMURA; Masaya ;   et al.
2015-02-19
Circuit Module
App 20150043171 - MUGIYA; Eiji ;   et al.
2015-02-12
Circuit Module And Method Of Producing The Same
App 20150043170 - SHIMAMURA; Masaya ;   et al.
2015-02-12
Circuit Module And Method Of Producing Circuit Module
App 20150043172 - MUGIYA; Eiji ;   et al.
2015-02-12
Circuit Module And Method Of Producing Circuit Module
App 20150044822 - MUGIYA; Eiji ;   et al.
2015-02-12
Circuit Module And Method Of Producing The Same
App 20150043189 - KITAZAKI; Kenzo ;   et al.
2015-02-12
Circuit Module And Method Of Producing The Same
App 20150016066 - SHIMAMURA; Masaya ;   et al.
2015-01-15
Circuit module
Grant 8,897,019 - Shimamura , et al. November 25, 2
2014-11-25
Circuit module and method of producing circuit module
Grant 8,890,309 - Mugiya , et al. November 18, 2
2014-11-18
Circuit Module And Production Method Therefor
App 20140293550 - MUGIYA; Eiji ;   et al.
2014-10-02
Substrate With Built-in Electronic Component
App 20140049928 - Sawatari; Tatsuro ;   et al.
2014-02-20
Circuit Module And Method Of Manufacturing The Same
App 20130271928 - SHIMAMURA; Masaya ;   et al.
2013-10-17
Substrate with built-in electronic component
Grant 8,536,959 - Mugiya , et al. September 17, 2
2013-09-17
Multi-layer board incorporating electronic component and method for producing the same
Grant 8,314,343 - Inoue , et al. November 20, 2
2012-11-20
Multi-layer Board Incorporating Electronic Component And Method For Producing The Same
App 20090084596 - INOUE; Yusuke ;   et al.
2009-04-02
Semiconductor device and unit equipped with the same
App 20060186519 - Inoue; Taizo ;   et al.
2006-08-24

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