MUELLER; Brennen K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for MUELLER; Brennen K..The latest application filed is for "fabrication and use of through silicon vias on double sided interconnect device".
- MUELLER; Brennen K. - Hillsboro OR
- Mueller; Brennen K. - Portland OR
| Patent | Date |
|---|---|
| Fabrication And Use Of Through Silicon Vias On Double Sided Interconnect Device App 20220130803 - MUELLER; Brennen K. ; et al. | 2022-04-28 |
| Fabrication and use of through silicon vias on double sided interconnect device Grant 11,251,156 - Mueller , et al. February 15, 2 | 2022-02-15 |
| Selective recess of interconnects for probing hybrid bond devices Grant 11,189,585 - Mueller , et al. November 30, 2 | 2021-11-30 |
| Fluid viscosity control during wafer bonding Grant 11,056,356 - Mueller , et al. July 6, 2 | 2021-07-06 |
| Selective Recess Of Interconnects For Probing Hybrid Bond Devices App 20210175192 - Mueller; Brennen K. ; et al. | 2021-06-10 |
| Wafer to wafer bonding with low wafer distortion Grant 10,720,345 - Kobrinsky , et al. | 2020-07-21 |
| Permanent Functional Carrier Systems And Methods App 20190057950 - Mueller; Brennen K. ; et al. | 2019-02-21 |
| Fabrication And Use Of Through Silicon Vias On Double Sided Interconnect Device App 20180323174 - MUELLER; Brennen K. ; et al. | 2018-11-08 |
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