Muehlbauer; Franz-Xaver

Patent Applications and Registrations

Patent applications and USPTO patent grants for Muehlbauer; Franz-Xaver.The latest application filed is for "semiconductor device including an antenna".

Company Profile

4.6.7

Muehlbauer; Franz-Xaver - Rimbach DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Including An Antenna App 20220148951 - Huynh; Ngoc-Hoa ; et al.	2022-05-12
Semiconductor device including an antenna Grant 11,195,787 - Huynh , et al. December 7, 2	2021-12-07
Semiconductor device including a cavity lid Grant 10,626,012 - Muehlbauer , et al.	2020-04-21
Semiconductor package with a through port for sensor applications Grant 10,549,985 - Maier , et al. Fe	2020-02-04
Semiconductor Apparatuses With Radio-frequency Line Elements, And Associated Manufacturing Methods App 20190198455 - HARTNER; Walter ; et al.	2019-06-27
Bonded system and a method for adhesively bonding a hygroscopic material Grant 10,332,814 - Von Waechter , et al.	2019-06-25
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture App 20180148322 - Maier; Dominic ; et al.	2018-05-31
Chip package and a method of producing the same Grant 9,981,843 - Maier , et al. May 29, 2	2018-05-29
Semiconductor Device Including An Antenna App 20170236776 - Huynh; Ngoc-Hoa ; et al.	2017-08-17
Semiconductor device including a MEMS die and a conductive layer Grant 9,725,303 - Maier , et al. August 8, 2	2017-08-08
Chip Package and a Method of Producing the Same App 20160311679 - Maier; Dominic ; et al.	2016-10-27
Semiconductor Device Including A Cavity Lid App 20160297672 - Muehlbauer; Franz-Xaver ; et al.	2016-10-13
Bonded System And A Method For Adhesively Bonding A Hygroscopic Material App 20160247739 - Von Waechter; Claus ; et al.	2016-08-25

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