Mu Chun
USPTO Trademark & Patent Filings
Trademark applications and grants for Mu Chun. Mu Chun has 1 trademark applications. The latest application filed is for "NOWUS"
| Patent Application | Date |
|---|---|
| COF packaged semiconductor 20020185745 - 09/777833 Ma, Qing ; et al. | 2002-12-12 |
| Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures 7,189,596 - 09/661,899 Mu , et al. March 13, 2 | 2007-03-13 |
| Integrated core microelectronic package 6,825,063 - 10/612,744 Vu , et al. November 30, 2 | 2004-11-30 |
| Flip-chip on flex for high performance packaging applications 6,743,664 - 10/015,819 Liang , et al. June 1, 2 | 2004-06-01 |
| COF packaged semiconductor 6,737,754 - 09/777,833 Ma , et al. May 18, 2 | 2004-05-18 |
| Direct build-up layer on an encapsulated die package 6,271,469 - 09/438,221 Ma , et al. August 7, 2 | 2001-08-07 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"NOWUS" 5539122 87667333 |
NOWUS 2017-11-01 |
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