Movva; Sashidhar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Movva; Sashidhar.The latest application filed is for "process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)".

Company Profile

0.4.6

Movva; Sashidhar - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process For Improving Package Warpage And Connection Reliability Through Use Of A Backside Mold Configuration (bsmc) App 20150221528 - Bchir; Omar James ; et al.	2015-08-06
Process For Improving Package Warpage And Connection Reliability Through Use Of A Backside Mold Configuration (bsmc) App 20140227835 - Bchir; Omar James ; et al.	2014-08-14
Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC) Grant 8,742,603 - Bchir , et al. June 3, 2	2014-06-03
Selective seed layer treatment for feature plating Grant 8,703,602 - Bchir , et al. April 22, 2	2014-04-22
Selective Seed Layer Treatment for Feature Plating App 20120139112 - Bchir; Omar J. ; et al.	2012-06-07
Method and Apparatus for Improving Substrate Warpage App 20120090883 - Bchir; Omar J. ; et al.	2012-04-19
Electronic Package and Method of Making an Electronic Package App 20120080787 - Shah; Milind P. ; et al.	2012-04-05
Process For Improving Package Warpage and Connection Reliability Through Use Of A Backside Mold Configuration (BSMC) App 20110285026 - Bchir; Omar J. ; et al.	2011-11-24

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