loadpatents
name:-0.0013589859008789
name:-0.0091681480407715
name:-0.00042200088500977
Mountsier; Tom Patent Filings

Mountsier; Tom

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mountsier; Tom.The latest application filed is for "tungsten barrier and seed for copper filled tsv".

Company Profile
0.9.1
  • Mountsier; Tom - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tungsten barrier and seed for copper filled TSV
Grant 8,709,948 - Danek , et al. April 29, 2
2014-04-29
Methods for reducing UV and dielectric diffusion barrier interaction
Grant 8,173,537 - Chattopadhyay , et al. May 8, 2
2012-05-08
Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties
Grant 8,124,522 - Wu , et al. February 28, 2
2012-02-28
Tungsten Barrier And Seed For Copper Filled Tsv
App 20110221044 - Danek; Michal ;   et al.
2011-09-15
Methods of forming moisture barrier for low K film integration with anti-reflective layers
Grant 8,003,549 - Li , et al. August 23, 2
2011-08-23
Multistep method of depositing metal seed layers
Grant 7,682,966 - Rozbicki , et al. March 23, 2
2010-03-23
Methods of forming moisture barrier for low k film integration with anti-reflective layers
Grant 7,642,202 - Li , et al. January 5, 2
2010-01-05
Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing
Grant 7,052,988 - van Schravendijk , et al. May 30, 2
2006-05-30
Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing
Grant 6,720,251 - van Schravendijk , et al. April 13, 2
2004-04-13

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