Mountsier; Thomas W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mountsier; Thomas W..The latest application filed is for "high aspect ratio etch of oxide metal oxide metal stack".
- Mountsier; Thomas W. - San Jose CA
- Mountsier; Thomas W - San Jose CA
| Patent | Date |
|---|---|
| High aspect ratio etch of oxide metal oxide metal stack Grant 10,242,883 - Guha , et al. | 2019-03-26 |
| High Aspect Ratio Etch Of Oxide Metal Oxide Metal Stack App 20180374712 - GUHA; Joydeep ; et al. | 2018-12-27 |
| High aspect ratio etch with combination mask Grant 9,659,783 - Guha , et al. May 23, 2 | 2017-05-23 |
| Plasma activated conformal film deposition Grant 9,230,800 - LaVoie , et al. January 5, 2 | 2016-01-05 |
| High Aspect Ratio Etch With Combination Mask App 20150200106 - GUHA; Joydeep ; et al. | 2015-07-16 |
| High aspect ratio etch with combination mask Grant 9,018,103 - Guha , et al. April 28, 2 | 2015-04-28 |
| High Aspect Ratio Etch With Combination Mask App 20150087154 - GUHA; Joydeep ; et al. | 2015-03-26 |
| Plasma Activated Conformal Film Deposition App 20140209562 - LaVoie; Adrien ; et al. | 2014-07-31 |
| Plasma activated conformal film deposition Grant 8,728,956 - LaVoie , et al. May 20, 2 | 2014-05-20 |
| Diffusion barrier layers Grant 8,053,861 - Mountsier , et al. November 8, 2 | 2011-11-08 |
| Plasma Activated Conformal Film Deposition App 20110256726 - LaVoie; Adrien ; et al. | 2011-10-20 |
| Protection of Cu damascene interconnects by formation of a self-aligned buffer layer Grant 8,030,777 - van Schravendijk , et al. October 4, 2 | 2011-10-04 |
| Low-k b-doped SiC copper diffusion barrier films Grant 7,842,604 - Yu , et al. November 30, 2 | 2010-11-30 |
| Diffusion Barrier Layers App 20100187693 - Mountsier; Thomas W. ; et al. | 2010-07-29 |
| Boron-doped SIC copper diffusion barrier films Grant 7,420,275 - Yu , et al. September 2, 2 | 2008-09-02 |
| Protection of Cu damascene interconnects by formation of a self-aligned buffer layer Grant 7,396,759 - van Schravendijk , et al. July 8, 2 | 2008-07-08 |
| Low-k B-doped SiC copper diffusion barrier films Grant 7,239,017 - Yu , et al. July 3, 2 | 2007-07-03 |
| Method for patterning multilevel interconnects Grant 6,875,699 - Lassig , et al. April 5, 2 | 2005-04-05 |
| Chemical vapor deposition system including dedicated cleaning gas injection Grant 6,200,412 - Kilgore , et al. March 13, 2 | 2001-03-13 |
| High aspect ratio gapfill process by using HDP Grant 5,872,058 - Van Cleemput , et al. February 16, 1 | 1999-02-16 |
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