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Patent applications and USPTO patent grants for Moulder; John F..The latest application filed is for "system and method for depth profiling and characterization of thin films".
Patent | Date |
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System and method for depth profiling and characterization of thin films Grant 7,449,682 - Larson , et al. November 11, 2 | 2008-11-11 |
System and method for depth profiling and characterization of thin films App 20040238735 - Larson, Paul E. ;   et al. | 2004-12-02 |
Nondestructive characterization of thin films using measured basis spectra Grant 6,800,852 - Larson , et al. October 5, 2 | 2004-10-05 |
Nondestructive characterization of thin films using measured basis spectra App 20040135081 - Larson, Paul E. ;   et al. | 2004-07-15 |
System and method for characterization of thin films App 20030080291 - Larson, Paul E. ;   et al. | 2003-05-01 |
Integrated circuit metallization technique Grant 4,513,905 - Nowicki , et al. April 30, 1 | 1985-04-30 |
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