loadpatents
name:-0.018826961517334
name:-0.013085842132568
name:-0.00089192390441895
Mottura; Marta Patent Filings

Mottura; Marta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mottura; Marta.The latest application filed is for "bottled epitaxy in source and drain regions of fets".

Company Profile
0.12.16
  • Mottura; Marta - Albany NY
  • Mottura; Marta - Milan N/A IT
  • MOTTURA; Marta - Milano MI
  • MOTTURA; Marta - Milano IT
  • Mottura; Marta - Phoenix AZ
  • Mottura; Marta - Melegnano IT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Prevention of faceting in epitaxial source drain transistors
Grant 8,987,827 - Montanini , et al. March 24, 2
2015-03-24
Bottled Epitaxy In Source And Drain Regions Of Fets
App 20140353741 - Montanini; Pietro ;   et al.
2014-12-04
Process for etching trenches in an integrated optical device
Grant 8,486,741 - Montanini , et al. July 16, 2
2013-07-16
Deep contacts of integrated electronic devices based on regions implanted through trenches
Grant 8,476,143 - Montanini , et al. July 2, 2
2013-07-02
Deep Contacts Of Integrated Electronic Devices Based On Regions Implanted Through Trenches
App 20130017676 - MONTANINI; Pietro ;   et al.
2013-01-17
Process For Etching Trenches In An Integrated Optical Device
App 20120228260 - MONTANINI; Pietro ;   et al.
2012-09-13
SOI device with contact trenches formed during epitaxial growing
Grant 8,183,098 - Montanini , et al. May 22, 2
2012-05-22
Method of fabrication of plastic film supported single crystal silicon photovoltaic cell structure
Grant 8,124,865 - Montanini , et al. February 28, 2
2012-02-28
Deep contacts of integrated electronic devices based on regions implanted through trenches
Grant 8,115,314 - Montanini , et al. February 14, 2
2012-02-14
Front-rear contacts of electronics devices with induced defects to increase conductivity thereof
Grant 7,999,349 - Montanini , et al. August 16, 2
2011-08-16
Soi Device With Contact Trenches Formed During Epitaxial Growing
App 20100075484 - Montanini; Pietro ;   et al.
2010-03-25
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
Grant 7,595,223 - Mastromatteo , et al. September 29, 2
2009-09-29
Deep Contacts Of Integrated Electronic Devices Based On Regions Implanted Through Trenches
App 20090152733 - Montanini; Pietro ;   et al.
2009-06-18
Front-rear contacts of electronics devices with induced defects to increase conductivity thereof
App 20080017949 - Montanini; Pietro ;   et al.
2008-01-24
SOI device with contact trenches formed during epitaxial growing
App 20070296036 - Montanini; Pietro ;   et al.
2007-12-27
Process For Bonding And Electrically Connecting Microsystems Integrated In Several Distinct Substrates
App 20070254454 - Mastromatteo; Ubaldo ;   et al.
2007-11-01
Plastic film supported single crystal silicon photovoltaic cell structure and method of fabrication
App 20060118164 - Montanini; Pietro ;   et al.
2006-06-08
Method of manufacturing an integrated optical waveguide
App 20060096324 - Montani; Pietro ;   et al.
2006-05-11
Process for etching trenches in an integrated optical device
App 20060068554 - Montanini; Pietro ;   et al.
2006-03-30
Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling
Grant 6,869,856 - Combi , et al. March 22, 2
2005-03-22
Wave guide manufactoring method and wave guide
App 20040152020 - Montanini, Pietro ;   et al.
2004-08-05
Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness
Grant 6,689,627 - Mottura , et al. February 10, 2
2004-02-10
Process for manufacturing a semiconductor wafer integrating electronic devices and a structure for electromagnetic decoupling
App 20030113981 - Combi, Chantal ;   et al.
2003-06-19
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
App 20030109183 - Mastromatteo, Ubaldo ;   et al.
2003-06-12
Process for manufacturing components in a semiconductor material wafer with reduction in the starting wafer thickness
App 20020127761 - Mottura, Marta ;   et al.
2002-09-12

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