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Patent applications and USPTO patent grants for Motschman; David Roy.The latest application filed is for "nested fin integral heat sink assembly for multiple high power electonic circuit board modules".
Patent | Date |
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Nested Fin Integral Heat Sink Assembly For Multiple High Power Electonic Circuit Board Modules App 20090284931 - Babock; Raymond Floyd ;   et al. | 2009-11-19 |
Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same App 20090213541 - Butterbaugh; Matthew Allen ;   et al. | 2009-08-27 |
Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitry Grant 7,551,444 - Anderl , et al. June 23, 2 | 2009-06-23 |
Method And Computer System With Anti-tamper Capability And Thermal Packaging Structure For Implementing Enhanced Heat Removal From Processor Circuitry App 20090109611 - Anderl; William James ;   et al. | 2009-04-30 |
Enhanced optical transceiver arrangement Grant 6,652,159 - Chan , et al. November 25, 2 | 2003-11-25 |
Enhanced optical transceiver arrangement App 20030002824 - Chan, Benson ;   et al. | 2003-01-02 |
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