Motschman; David R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Motschman; David R..The latest application filed is for "horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance".

Company Profile

0.12.8

Motschman; David R. - Rochester MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat exchangers for cooling integrated circuits Grant 9,655,287 - Babcock , et al. May 16, 2	2017-05-16
Air-cooled heatsink for cooling integrated circuits Grant 9,609,785 - Babcock , et al. March 28, 2	2017-03-28
Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance Grant 9,245,813 - Bartley , et al. January 26, 2	2016-01-26
Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks Grant 9,111,899 - Bartley , et al. August 18, 2	2015-08-18
Horizontally Aligned Graphite Nanofibers In Etched Silicon Wafer Troughs For Enhanced Thermal Performance App 20140210068 - Bartley; Gerald K. ; et al.	2014-07-31
Horizontally And Vertically Aligned Graphite Nanofibers Thermal Interface Material For Use In Chip Stacks App 20140070393 - Bartley; Gerald K. ; et al.	2014-03-13
Thermal cycling and gradient management in three-dimensional stacked architectures Grant 8,489,217 - Cher , et al. July 16, 2	2013-07-16
Method and system for internal layer-layer thermal enhancement Grant 8,367,478 - Bartley , et al. February 5, 2	2013-02-05
Method And System For Internal Layer-layer Thermal Enhancement App 20120306088 - BARTLEY; Gerald K. ; et al.	2012-12-06
Enhanced thermal management of 3-D stacked die packaging Grant 8,299,608 - Bartley , et al. October 30, 2	2012-10-30
Thermal Cycling and Gradient Management in Three-Dimensional Stacked Architectures App 20120173036 - Cher; Chen-Yong ; et al.	2012-07-05
Memory module connector having memory module cooling structures Grant 8,139,355 - Motschman , et al. March 20, 2	2012-03-20
Enhanced Thermal Management Of 3-d Stacked Die Packaging App 20120007229 - Bartley; Gerald K. ; et al.	2012-01-12
Memory Module Connector Having Memory Module Cooling Structures App 20110286179 - Motschman; David R. ; et al.	2011-11-24
Methods, Systems, and Computer Program Products for Implementing Spread Spectrum Using Digital Signal Processing Techniques App 20090147827 - Holmquist; Richard ; et al.	2009-06-11
Apparatus for cooling electronics components Grant 5,027,254 - Corfits , et al. June 25, 1	1991-06-25

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