Motoyama; Yasuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Motoyama; Yasuhiro.The latest application filed is for "method of manufacturing semiconductor integrated circuit device".

Company Profile

0.20.23

Motoyama; Yasuhiro - Tokyo JP
Motoyama; Yasuhiro - Kanagawa JP
Motoyama; Yasuhiro - Hachioji JP
Motoyama; Yasuhiro - Kodaira JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method of semiconductor integrated circuit device Grant 8,357,933 - Hasebe , et al. January 22, 2	2013-01-22
Method of manufacturing semiconductor integrated circuit device Grant 8,323,992 - Nakamura , et al. December 4, 2	2012-12-04
Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same Grant 8,206,997 - Hasebe , et al. June 26, 2	2012-06-26
Method Of Manufacturing Semiconductor Integrated Circuit Device App 20120064646 - NAKAMURA; Seigo ; et al.	2012-03-15
Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same Grant 8,062,911 - Hasebe , et al. November 22, 2	2011-11-22
Fabrication Method Of Semiconductor Integrated Circuit Device App 20110175634 - Okamoto; Masayoshi ; et al.	2011-07-21
Fabrication Method Of Semiconductor Integrated Circuit Device App 20110136272 - OKAMOTO; Masayoshi ; et al.	2011-06-09
Fabrication method of semiconductor integrated circuit device Grant 7,901,958 - Okamoto , et al. March 8, 2	2011-03-08
Fabrication Method Of Semiconductor Integrated Circuit Device App 20100304510 - OKAMOTO; Masayoshi ; et al.	2010-12-02
Manufactoring Method Of Semiconductor Integrated Circuit Device App 20100277192 - HASEBE; Akio ; et al.	2010-11-04
Method Of Manufacturing A Semiconductor Integrated Circuit Device And A Method Of Manufacturing A Thin Film Probe Sheet For Using The Same App 20100279502 - Hasebe; Akio ; et al.	2010-11-04
Manufacturing method of semiconductor integrated circuit device Grant 7,776,626 - Hasebe , et al. August 17, 2	2010-08-17
Fabrication method of semiconductor integrated circuit device and probe card Grant 7,688,086 - Motoyama , et al. March 30, 2	2010-03-30
Manufacturing method of semiconductor integrated circuit device Grant 7,598,100 - Matsumoto , et al. October 6, 2	2009-10-06
Method of manufacturing a semiconductor integrated circuit device Grant 7,537,943 - Hasebe , et al. May 26, 2	2009-05-26
Manufacturing Method Of Semiconductor Integrated Circuit Device App 20090130785 - Matsumoto; Hideyuki ; et al.	2009-05-21
Manufacturing method of semiconductor integrated circuit device and probe card Grant 7,517,707 - Okamoto , et al. April 14, 2	2009-04-14
Manufacturing Method Of Semiconductor Integrated Circuit Device App 20090017565 - Hasebe; Akio ; et al.	2009-01-15
Manufacturing method of semiconductor integrated circuit device Grant 7,407,823 - Hasebe , et al. August 5, 2	2008-08-05
Method Of Manufacturing A Semiconductor Integrated Circuit Device And A Method Of Manufacturing A Thin Film Probe Sheet For Using The Same App 20080160657 - Hasebe; Akio ; et al.	2008-07-03
Method Of Manufacturing A Semiconductor Integrated Circuit Device App 20080096295 - HASEBE; Akio ; et al.	2008-04-24
Fabrication method of semiconductor integrated circuit device Grant 7,351,597 - Wada , et al. April 1, 2	2008-04-01
Fabrication Method Of Semiconductor Integrated Circuit Device App 20080020498 - OKAMOTO; Masayoshi ; et al.	2008-01-24
Fabrication Method Of Semiconductor Integrated Circuit Device App 20070218572 - Wada; Yuji ; et al.	2007-09-20
Manufacturing method of semiconductor integrated circuit device and probe card Grant 7,271,015 - Okamoto , et al. September 18, 2	2007-09-18
Fabrication Method Of Semiconductor Integrated Circuit Device App 20070207559 - Hasebe; Akio ; et al.	2007-09-06
Manufacturing method of semiconductor integrated circuit device and probe card App 20070190671 - Okamoto; Masayoshi ; et al.	2007-08-16
Fabrication method of semiconductor integrated circuit device Grant 7,235,413 - Hasebe , et al. June 26, 2	2007-06-26
Fabrication method of semiconductor integrated circuit device Grant 7,219,422 - Wada , et al. May 22, 2	2007-05-22
Fabrication Method Of Semiconductor Integrated Circuit Device And Probe Card App 20070108997 - Motoyama; Yasuhiro ; et al.	2007-05-17
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Grant 7,198,962 - Kohno , et al. April 3, 2	2007-04-03
Manufacturing method of semiconductor integrated circuit device and probe card App 20050227383 - Okamoto, Masayoshi ; et al.	2005-10-13
Fabrication method of semiconductor integrated circuit device App 20050095734 - Hasebe, Akio ; et al.	2005-05-05
Fabrication method of semiconductor integrated circuit device App 20050093565 - Okamoto, Masayoshi ; et al.	2005-05-05
Fabrication method of semiconductor integrated circuit device App 20040183556 - Wada, Yuji ; et al.	2004-09-23
Fabrication method of semiconductor integrated circuit device and its testing apparatus App 20040135593 - Ban, Naoto ; et al.	2004-07-15
Fabrication method of semiconductor integrated circuit device and its testing apparatus Grant 6,696,849 - Ban , et al. February 24, 2	2004-02-24
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step App 20030203521 - Kohno, Ryuji ; et al.	2003-10-30
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step App 20020182796 - Kohno, Ryuji ; et al.	2002-12-05
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Grant 6,455,335 - Kohno , et al. September 24, 2	2002-09-24
Fabrication method of semiconductor integrated circuit device and its testing apparatus App 20020039802 - Ban, Naoto ; et al.	2002-04-04
Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step Grant 6,197,603 - Kohno , et al. March 6, 2	2001-03-06

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.