| Patent | Date |
|---|
Inorganic film-forming composition for multilayer resist processes, and pattern-forming method
Grant 10,090,163 - Nakagawa , et al. October 2, 2 | 2018-10-02 |
Composition for forming resist underlayer film, and pattern-forming method
Grant 9,268,229 - Tanaka , et al. February 23, 2 | 2016-02-23 |
Inorganic Film-forming Composition For Multilayer Resist Processes, And Pattern-forming Method
App 20150364332 - Nakagawa; Hisashi ; et al. | 2015-12-17 |
Method for forming pattern, and composition for forming resist underlayer film
Grant 9,182,671 - Nakafuji , et al. November 10, 2 | 2015-11-10 |
Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming method
Grant 9,091,922 - Nakafuji , et al. July 28, 2 | 2015-07-28 |
Composition For Forming Resist Underlayer Film, Resist Underlayer Film And Resist Underlayer Film-forming Method, And Pattern-forming Method
App 20150198882 - NAKAFUJI; Shin-ya ; et al. | 2015-07-16 |
Multilayer resist process pattern-forming method and multilayer resist process inorganic film-forming composition
Grant 8,927,201 - Takanashi , et al. January 6, 2 | 2015-01-06 |
Composition For Forming Resist Underlayer Film, Resist Underlayer Film And Resist Underlayer Film-forming Method, And Pattern-forming Method
App 20140272722 - NAKAFUJI; Shin-ya ; et al. | 2014-09-18 |
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
Grant 8,741,008 - Motonari , et al. June 3, 2 | 2014-06-03 |
Multilayer Resist Process Pattern-forming Method And Multilayer Resist Process Inorganic Film-forming Composition
App 20140030660 - TAKANASHI; Kazunori ; et al. | 2014-01-30 |
Resin Composition, Resist Underlayer Film, Resist Underlayer Film-forming Method And Pattern-forming Method
App 20140014620 - NAKAFUJI; Shin-ya ; et al. | 2014-01-16 |
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method For Semiconductor Device
App 20140011360 - NAMIE; Yuuji ; et al. | 2014-01-09 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
Grant 8,574,330 - Namie , et al. November 5, 2 | 2013-11-05 |
Composition For Forming Resist Underlayer Film, And Pattern-forming Method
App 20130256264 - TANAKA; Hiromitsu ; et al. | 2013-10-03 |
Resin Composition, Resist Underlayer Film, Resist Underlayer Film-forming Method And Pattern-forming Method
App 20130153535 - NAKAFUJI; Shin-ya ; et al. | 2013-06-20 |
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
Grant 8,262,435 - Kunitani , et al. September 11, 2 | 2012-09-11 |
Chemical mechanical polishing pad
Grant 8,128,464 - Motonari , et al. March 6, 2 | 2012-03-06 |
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method
App 20110059680 - Motonari; Masayuki ; et al. | 2011-03-10 |
Chemical Mechanical Polishing Aqueous Dispersion, Chemical Mechanical Polishing Method, And Chemical Mechanical Polishing Aqueous Dispersion Preparation Kit
App 20090291620 - KUNITANI; Eiichirou ; et al. | 2009-11-26 |
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method For Semiconductor Device
App 20090221213 - Namie; Yuuji ; et al. | 2009-09-03 |
Chemical Mechanical Polishing Pad
App 20090209185 - Motonari; Masayuki ; et al. | 2009-08-20 |
Metal-coating Material, Method For Protecting Metal, And Light Emitting Device
App 20090189510 - KANAMORI; Tarou ; et al. | 2009-07-30 |
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
Grant 7,183,211 - Konno , et al. February 27, 2 | 2007-02-27 |
Method of chemical mechanical polishing
Grant 7,153,369 - Motonari , et al. December 26, 2 | 2006-12-26 |
Aqueous dispersion for chemical mechanical polishing
Grant 7,087,530 - Motonari , et al. August 8, 2 | 2006-08-08 |
Window member for chemical mechanical polishing and polishing pad
Grant 6,832,949 - Konno , et al. December 21, 2 | 2004-12-21 |
Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device
App 20040162011 - Konno, Tomohisa ; et al. | 2004-08-19 |
Aqueous dispersion for chemical mechanical polishing
App 20040144755 - Motonari, Masayuki ; et al. | 2004-07-29 |
Aqueous dispersion for chemical mechanical polishing used for polishing of copper
Grant 6,653,267 - Yano , et al. November 25, 2 | 2003-11-25 |
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
App 20030153183 - Konno, Tomohisa ; et al. | 2003-08-14 |
Window member for chemical mechanical polishing and polishing pad
App 20030129931 - Konno, Tomohisa ; et al. | 2003-07-10 |
Method of chemical mechanical polishing
App 20020193451 - Motonari, Masayuki ; et al. | 2002-12-19 |
Aqueous dispersion for chemical mechanical polishing used for polishing of copper
App 20020016275 - Yano, Hiroyuki ; et al. | 2002-02-07 |
Aqueous dispersion for chemical mechanical polishing
App 20020005017 - Motonari, Masayuki ; et al. | 2002-01-17 |
Aqueous dispersion for chemical mechanical polishing
App 20010049912 - Motonari, Masayuki ; et al. | 2001-12-13 |
Polymer particles and polishing material containing them
App 20010039322 - Hattori, Masayuki ; et al. | 2001-11-08 |
Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
App 20010008828 - Uchikura, Kazuhito ; et al. | 2001-07-19 |
Ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber composition
Grant 5,691,413 - Morikawa , et al. November 25, 1 | 1997-11-25 |
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