loadpatents
name:-0.03290319442749
name:-0.028902053833008
name:-0.010378122329712
Motomura; Koji Patent Filings

Motomura; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Motomura; Koji.The latest application filed is for "auxiliary joining agent and method for producing the same".

Company Profile
10.29.32
  • Motomura; Koji - Osaka JP
  • Motomura; Koji - Fukuoka JP
  • Motomura; Koji - Saga JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mounting Method of a semiconductor device using a colored auxiliary joining agent
Grant 10,786,876 - Kojio , et al. September 29, 2
2020-09-29
Laminated nonwoven fabric and manufacturing method thereof
Grant 10,464,286 - Nakamura , et al. No
2019-11-05
Filter
Grant 10,464,003 - Motomura , et al. No
2019-11-05
Laminate and manufacturing method thereof
Grant 10,464,285 - Ikeda , et al. No
2019-11-05
Stacked body
Grant 10,413,856 - Motomura , et al. Sept
2019-09-17
Mounting structure and method for manufacturing same
Grant 10,412,834 - Kishi , et al. Sept
2019-09-10
Fiber laminate and manufacturing method thereof
Grant 10,232,293 - Motomura , et al.
2019-03-19
Laminated nonwoven fabric and air purifier
Grant 10,220,340 - Motomura , et al.
2019-03-05
Laminated nonwoven fabric and air purifier
Grant 10,195,556 - Motomura , et al. Fe
2019-02-05
Laminated nonwoven fabric, air purifier, and manufacturing method of laminated nonwoven fabric
Grant 10,173,158 - Motomura , et al. J
2019-01-08
Circuit board interconnection structure and circuit board interconnection method
Grant 10,080,298 - Eifuku , et al. September 18, 2
2018-09-18
Auxiliary Joining Agent And Method For Producing The Same
App 20180236613 - Kojio; Teppei ;   et al.
2018-08-23
Filter
App 20180093214 - MOTOMURA; KOJI ;   et al.
2018-04-05
Stacked Body
App 20180085698 - MOTOMURA; KOJI ;   et al.
2018-03-29
Film material, electronic component using film material, and method for producing electronic component
Grant 9,902,880 - Motomura February 27, 2
2018-02-27
Mounting Structure And Method For Manufacturing Same
App 20170374743 - KISHI; Arata ;   et al.
2017-12-28
Electrode joining method, production method of electrode joined structure
Grant 9,839,143 - Motomura , et al. December 5, 2
2017-12-05
Mounting structure and method for manufacturing same
Grant 9,795,036 - Kishi , et al. October 17, 2
2017-10-17
Fiber Laminate And Manufacturing Method Thereof
App 20170252685 - Motomura; Koji ;   et al.
2017-09-07
Component-mounted structure
Grant 9,756,728 - Sakai , et al. September 5, 2
2017-09-05
Laminate And Manufacturing Method Thereof
App 20170217124 - IKEDA; Kouji ;   et al.
2017-08-03
Laminated Nonwoven Fabric And Manufacturing Method Thereof
App 20170151752 - NAKAMURA; Taichi ;   et al.
2017-06-01
Laminated Nonwoven Fabric
App 20170151748 - MOTOMURA; Koji ;   et al.
2017-06-01
Electronic component mounting method
Grant 9,609,760 - Saeki , et al. March 28, 2
2017-03-28
Laminated Nonwoven Fabric And Air Purifier
App 20170028329 - MOTOMURA; KOJI ;   et al.
2017-02-02
Laminated Nonwoven Fabric, Air Purifier, And Manufacturing Method Of Laminated Nonwoven Fabric
App 20160367924 - MOTOMURA; KOJI ;   et al.
2016-12-22
Electronic component-mounted structure, IC card and COF package
Grant 9,516,749 - Wada , et al. December 6, 2
2016-12-06
Film Material, Electronic Component Using Film Material, And Method For Producing Electronic Component
App 20160280965 - MOTOMURA; Koji
2016-09-29
Nonwoven Fabric, Air Purifier Using The Same, And Method For Producing Nonwoven Fabric
App 20160199765 - MOTOMURA; Koji ;   et al.
2016-07-14
Laminated Nonwoven Fabric And Air Purifier
App 20160199766 - MOTOMURA; Koji ;   et al.
2016-07-14
Method and system for producing component mounting board
Grant 9,237,686 - Motomura , et al. January 12, 2
2016-01-12
Component-mounted Structure
App 20150208509 - Sakai; Tadahiko ;   et al.
2015-07-23
Electronic Component-mounted Structure, Ic Card And Cof Package
App 20150163903 - Wada; Yoshiyuki ;   et al.
2015-06-11
Mounting Structure And Method For Manufacturing Same
App 20150116970 - Kishi; Arata ;   et al.
2015-04-30
Auxiliary Joining Agent And Method For Producing The Same
App 20150096651 - Kojio; Teppei ;   et al.
2015-04-09
Electrode Joining Method, Production Method Of Electrode Joined Structure, And Production System Of Electrode Joined Structure
App 20150047185 - Motomura; Koji ;   et al.
2015-02-19
Circuit Board Interconnection Structure And Circuit Board Interconnection Method
App 20140318837 - EIFUKU; Hideki ;   et al.
2014-10-30
Substrate backing device and substrate thermocompression-bonding device
Grant 8,851,138 - Maruo , et al. October 7, 2
2014-10-07
Electronic component mounting system and electronic component mounting method
Grant 8,817,487 - Motomura , et al. August 26, 2
2014-08-26
Electronic Component Mounting Method, Electronic Component Placement Machine, And Electronic Component Mounting System
App 20140231492 - Saeki; Tsubasa ;   et al.
2014-08-21
Method And System For Producing Component Mounting Board
App 20140158751 - Motomura; Koji ;   et al.
2014-06-12
Electronic Component Mounting Method, Electronic Component Placement Machine, And Electronic Component Mounting System
App 20140096379 - Saeki; Tsubasa ;   et al.
2014-04-10
Electronic element unit and reinforcing adhesive agent
Grant 8,686,299 - Motomura , et al. April 1, 2
2014-04-01
Electronic component mounting system and electronic component mounting method
Grant 8,434,665 - Motomura , et al. May 7, 2
2013-05-07
Electronic Component Mounting Method
App 20120309133 - Wada; Yoshiyuki ;   et al.
2012-12-06
Substrate Receiving Device And Substrate Thermocompression-bonding Device
App 20120234496 - Maruo; Hiroki ;   et al.
2012-09-20
Electronic Element Unit And Reinforcing Adhesive Agent
App 20120111617 - Motomura; Koji ;   et al.
2012-05-10
Electronic Component Mounting System And Electronic Component Mounting Method
App 20120012645 - Motomura; Koji ;   et al.
2012-01-19
Electronic Component Mounting System And Electronic Component Mounting Method
App 20120014084 - Motomura; Koji ;   et al.
2012-01-19
Method For Manufacturing Electronic Component Module
App 20100327044 - Sakai; Tadahiko ;   et al.
2010-12-30
Method for manufacturing electronic parts module
Grant 7,845,074 - Motomura , et al. December 7, 2
2010-12-07
Method for manufacturing electronic parts module
Grant 7,841,081 - Motomura , et al. November 30, 2
2010-11-30
Method For Manufacturing Electronic Parts Module
App 20090260230 - Motomura; Koji ;   et al.
2009-10-22
Method For Manufacturing Electronic Parts Module
App 20090260229 - Motomura; Koji ;   et al.
2009-10-22

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