loadpatents
name:-0.006181001663208
name:-0.0024740695953369
name:-0.00069594383239746
Moteki; Takami Patent Filings

Moteki; Takami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moteki; Takami.The latest application filed is for "copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil".

Company Profile
0.4.7
  • Moteki; Takami - Nikko JP
  • Moteki; Takami - Tokyo JP
  • Moteki; Takami - Tochigi-ken JP
  • Moteki; Takami - Nikko-city JP
  • Moteki; Takami - Tochigi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ultrathin copper foil with carrier and printed circuit board using same
Grant 7,985,488 - Suzuki , et al. July 26, 2
2011-07-26
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
Grant 7,985,485 - Moteki , et al. July 26, 2
2011-07-26
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil
App 20110171486 - MOTEKI; Takami ;   et al.
2011-07-14
Ultrathin copper foil with carrier and printed circuit board using same
Grant 7,892,655 - Suzuki , et al. February 22, 2
2011-02-22
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same
App 20100270063 - Suzuki; Yuuji ;   et al.
2010-10-28
Ultrathin copper foil with carrier and printed circuit board using same
Grant 7,771,841 - Suzuki , et al. August 10, 2
2010-08-10
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil
App 20090324988 - Moteki; Takami ;   et al.
2009-12-31
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same
App 20070154692 - Suzuki; Yuuji ;   et al.
2007-07-05
Ultrathin copper foil with carrier and printed circuit board using same
App 20070141381 - Suzuki; Yuuji ;   et al.
2007-06-21
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
App 20070042212 - Moteki; Takami ;   et al.
2007-02-22
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
App 20050019599 - Moteki, Takami ;   et al.
2005-01-27

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