MOTEKI; Shigeru

Patent Applications and Registrations

Patent applications and USPTO patent grants for MOTEKI; Shigeru.The latest application filed is for "double-sided circuit substrate suitable for high-frequency circuits".

Company Profile

0.7.13

MOTEKI; Shigeru - Tokyo JP
Moteki; Shigeru - Kita-ku JP
Moteki; Shigeru - Annaka JP
Moteki; Shigeru - Annaka-shi JP
Moteki; Shigeru - Gunma JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Double-sided Circuit Substrate Suitable For High-frequency Circuits App 20170231088 - AKATUKA; Yasumasa ; et al.	2017-08-10
Primer resin for semiconductor device and semiconductor device Grant 8,410,620 - Uchida , et al. April 2, 2	2013-04-02
Heat-Resistant Adhesive App 20120288725 - Tanaka; Ryutaro ; et al.	2012-11-15
Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof App 20120178332 - Uchida; Makoto ; et al.	2012-07-12
Rubber-modified polyamide resin, epoxy resin composition and cured product thereof Grant 8,114,940 - Ishikawa , et al. February 14, 2	2012-02-14
Phenolic resin, process for production thereof, epoxy resin, and use thereof Grant 7,968,672 - Oshimi , et al. June 28, 2	2011-06-28
Process for producing microparticulate hardening catalyst Grant 7,863,345 - Koyanagi , et al. January 4, 2	2011-01-04
Copper foil with primer resin layer and laminated sheet using the same App 20100233476 - Uchida; Makoto ; et al.	2010-09-16
Primer Resin For Semiconductor Device And Semiconductor Device App 20100207282 - Uchida; Makoto ; et al.	2010-08-19
Phenolic Resin, Process for Production Thereof, Epoxy Resin, and Use Thereof App 20090286929 - Oshimi; Katsuhiko ; et al.	2009-11-19
Flame-retardant epoxy resin composition and cured product obtained therefrom Grant 7,608,336 - Akatsuka , et al. October 27, 2	2009-10-27
Rubber-Modified Polyamide Resin, Epoxy Resin Compositon and Cured Product Thereof App 20090071697 - Ishikawa; Kazunori ; et al.	2009-03-19
Process for producing a double-sided flexible printed board and double-sided flexible printed board App 20090056982 - Akatsuka; Yasumasa ; et al.	2009-03-05
Process for Producing Microparticulate Hardening Catalyst App 20090029848 - Koyanagi; Hiroo ; et al.	2009-01-29
Epoxy Resin, Epoxy Resin Composition, And Cured Material Thereof App 20080153976 - Akatsuka; Yasumasa ; et al.	2008-06-26
Substrate for flexible printed wiring board and method for manufacturing the same Grant 7,384,683 - Echigo , et al. June 10, 2	2008-06-10
Substrate for flexible printed wiring board and method for manufacturing the same App 20070071984 - Echigo; Yoshiaki ; et al.	2007-03-29
Flame retardant epoxy resin composition and cured object obtained therefrom App 20060058469 - Akatsuka; Yasumasa ; et al.	2006-03-16
Flame-retardant epoxy resin composition and cured product obtained therefrom App 20060003165 - Akatsuka; Yasumasa ; et al.	2006-01-05

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