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Patent applications and USPTO patent grants for Motegi; Masakazu.The latest application filed is for "glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity".
Patent | Date |
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Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity Grant 8,377,544 - Gaku , et al. February 19, 2 | 2013-02-19 |
Glass Fabric Base Material/thermosetting Resin Copper-clad Laminate Having A High-elasticity App 20110033659 - Gaku; Morio ;   et al. | 2011-02-10 |
Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity App 20060089070 - Gaku; Morio ;   et al. | 2006-04-27 |
Method for preparing thin copper foil-clad substrate for circuit boards Grant 4,917,758 - Ishizuka , et al. April 17, 1 | 1990-04-17 |
Thermosetting resin composition from cyanate ester and non-branched aromatic compound Grant 4,904,760 - Gaku , et al. February 27, 1 | 1990-02-27 |
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