Mostafazadeh; Shahram
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mostafazadeh; Shahram.The latest application filed is for "integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (cmut) array cells and array elements".
Company Profile
0.45.5
- Mostafazadeh; Shahram - San Jose CA
- Mostafazadeh; Shahram - Santa Clara CA
Patent Activity
| Patent | Date |
|---|---|
| Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements Grant 8,563,345 - Adler , et al. October 22, 2 | 2013-10-22 |
| Integration Of Structurally-stable Isolated Capacitive Micromachined Ultrasonic Transducer (cmut) Array Cells And Array Elements App 20120187508 - Adler; Steven J. ; et al. | 2012-07-26 |
| Metallurgy For Copper Plated Wafers App 20110024910 - MOSTAFAZADEH; Shahram ; et al. | 2011-02-03 |
| Metallurgy for copper plated wafers Grant 7,838,991 - Mostafazadeh , et al. November 23, 2 | 2010-11-23 |
| Micro surface mount die package and method Grant 7,514,769 - Mostafazadeh April 7, 2 | 2009-04-07 |
| Die-level opto-electronic device and method of making same Grant 7,468,288 - Mostafazadeh , et al. December 23, 2 | 2008-12-23 |
| Integrated circuit device package having a support coating for improved reliability during temperature cycling Grant 7,423,337 - Patwardhan , et al. September 9, 2 | 2008-09-09 |
| Packaging of a semiconductor device with a non-opaque cover Grant 7,405,100 - Mostafazadeh , et al. July 29, 2 | 2008-07-29 |
| Leadless microelectronic package and a method to maximize the die size in the package Grant 7,288,439 - Mostafazadeh , et al. October 30, 2 | 2007-10-30 |
| Lead frame chip scale package Grant RE39,854 - Mostafazadeh , et al. September 25, 2 | 2007-09-25 |
| Method and apparatus for forming an underfill adhesive layer Grant 7,253,078 - Nguyen , et al. August 7, 2 | 2007-08-07 |
| Multichip packages with exposed dice App 20070037320 - Mostafazadeh; Shahram ; et al. | 2007-02-15 |
| Apparatus and method for force mounting semiconductor packages to printed circuit boards Grant 7,171,745 - Mostafazadeh , et al. February 6, 2 | 2007-02-06 |
| Multichip packages with exposed dice Grant 7,144,800 - Mostafazadeh , et al. December 5, 2 | 2006-12-05 |
| Die-level opto-electronic device and method of making same Grant 7,098,518 - Mostafazadeh , et al. August 29, 2 | 2006-08-29 |
| Microarray lead frame Grant 7,095,096 - Mostafazadeh August 22, 2 | 2006-08-22 |
| Die with integral pedestal having insulated walls Grant 7,067,927 - Mostafazadeh June 27, 2 | 2006-06-27 |
| Bumped integrated circuits for optical applications Grant 7,012,282 - Mostafazadeh , et al. March 14, 2 | 2006-03-14 |
| Packaging of semiconductor device with a non-opaque cover Grant 7,002,241 - Mostafazadeh , et al. February 21, 2 | 2006-02-21 |
| Flip chip optical semiconductor on a PCB Grant 6,984,866 - Mostafazadeh , et al. January 10, 2 | 2006-01-10 |
| Chip scale pin array Grant 6,975,038 - Mostafazadeh December 13, 2 | 2005-12-13 |
| Multichip packages with exposed dice Grant 6,936,929 - Mostafazadeh , et al. August 30, 2 | 2005-08-30 |
| Leadless microelectronic package and a method to maximize the die size in the package Grant 6,894,376 - Mostafazadeh , et al. May 17, 2 | 2005-05-17 |
| Lead frame chip scale package Grant 6,888,228 - Mostafazadeh , et al. May 3, 2 | 2005-05-03 |
| Apparatus and method for force mounting semiconductor packages to printed circuit boards App 20050039330 - Mostafazadeh, Shahram ; et al. | 2005-02-24 |
| Multichip packages with exposed dice App 20040259288 - Mostafazadeh, Shahram ; et al. | 2004-12-23 |
| Apparatus and method for force mounting semiconductor packages to printed circuit boards Grant 6,823,582 - Mostafazadeh , et al. November 30, 2 | 2004-11-30 |
| Substrate for semiconductor packaging Grant 6,812,125 - Mostafazadeh November 2, 2 | 2004-11-02 |
| Lead frame design for chip scale package Grant 6,740,961 - Mostafazadeh May 25, 2 | 2004-05-25 |
| Apparatus and method of manufacturing a stackable package for a semiconductor device Grant 6,710,246 - Mostafazadeh , et al. March 23, 2 | 2004-03-23 |
| Chip scale pin array Grant 6,689,640 - Mostafazadeh February 10, 2 | 2004-02-10 |
| Lead frame design for chip scale package Grant 6,683,368 - Mostafazadeh January 27, 2 | 2004-01-27 |
| Method for molding a bumped wafer Grant 6,352,878 - Mostafazadeh , et al. March 5, 2 | 2002-03-05 |
| Techniques for wafer level molding of underfill encapsulant Grant 6,245,595 - Nguyen , et al. June 12, 2 | 2001-06-12 |
| Lead frame chip scale package Grant 6,130,473 - Mostafazadeh , et al. October 10, 2 | 2000-10-10 |
| Chip sized package Grant 6,054,772 - Mostafazadeh , et al. April 25, 2 | 2000-04-25 |
| Lead frame design for increased chip pinout Grant 6,034,423 - Mostafazadeh , et al. March 7, 2 | 2000-03-07 |
| Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same Grant 5,986,340 - Mostafazadeh , et al. November 16, 1 | 1999-11-16 |
| Plastic package with exposed die Grant 5,894,108 - Mostafazadeh , et al. April 13, 1 | 1999-04-13 |
| Method for connecting packages of a stacked ball grid array structure Grant 5,783,870 - Mostafazadeh , et al. July 21, 1 | 1998-07-21 |
| High density integrated circuit package assembly with a heatsink between stacked dies Grant 5,739,581 - Chillara , et al. April 14, 1 | 1998-04-14 |
| Thermal ball lead integrated package Grant 5,705,851 - Mostafazadeh , et al. January 6, 1 | 1998-01-06 |
| Ball grid array package with lead frame Grant 5,663,593 - Mostafazadeh , et al. September 2, 1 | 1997-09-02 |
| Semiconductor component package assembly including an integral RF/EMI shield Grant 5,650,659 - Mostafazadeh , et al. July 22, 1 | 1997-07-22 |
| Tape ball lead integrated circuit package Grant 5,648,679 - Chillara , et al. July 15, 1 | 1997-07-15 |
| Ball grid array with heat sink Grant 5,598,321 - Mostafazadeh , et al. January 28, 1 | 1997-01-28 |
| Lead frame having layered conductive planes Grant 5,498,901 - Chillara , et al. March 12, 1 | 1996-03-12 |
| High density integrated circuit assembly combining leadframe leads with conductive traces Grant 5,442,230 - Chillara , et al. August 15, 1 | 1995-08-15 |
| Method of and arrangement for preventing bonding wire shorts with certain integrated circuit components Grant 5,408,127 - Mostafazadeh April 18, 1 | 1995-04-18 |
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