MORTENSEN; Russell K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MORTENSEN; Russell K..The latest application filed is for "offset interposers for large-bottom packages and large-die package-on-package structures".

Company Profile

4.5.9

MORTENSEN; Russell K. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20220157799 - MORTENSEN; Russell K. ; et al.	2022-05-19
Microelectronic Package With Reduced Through-substrate Routing App 20210296241 - Sain; Arghya ; et al.	2021-09-23
Offset interposers for large-bottom packages and large-die package-on-package structures Grant 10,607,976 - Mortensen , et al.	2020-03-31
Logic die and other components embedded in build-up layers Grant 10,453,799 - Kulkarni , et al. Oc	2019-10-22
Offset interposers for large-bottom packages and large-die package-on-package structures Grant 10,446,530 - Mortensen , et al. Oc	2019-10-15
Logic Die And Other Components Embedded In Build-up Layers App 20170125351 - Kulkarni; Deepak V. ; et al.	2017-05-04
Logic die and other components embedded in build-up layers Grant 9,496,211 - Kulkarni , et al. November 15, 2	2016-11-15
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20160218093 - Mortensen; Russell K. ; et al.	2016-07-28
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20160133557 - Mortensen; Russell K. ; et al.	2016-05-12
Logic Die And Other Components Embedded In Build-up Layers App 20140138845 - Kulkarni; Deepak V. ; et al.	2014-05-22
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures App 20130271907 - Mortensen; Russell K. ; et al.	2013-10-17

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