Mortan; Robert F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mortan; Robert F..The latest application filed is for "packaged device having selective lead pullback for dimple depth control".
- Mortan; Robert F. - McKinney TX
| Patent | Date |
|---|---|
| Packaged Device Having Selective Lead Pullback For Dimple Depth Control App 20200066618 - Mortan; Robert F. | 2020-02-27 |
| Thermally enhanced semiconductor package Grant 7,038,311 - Woodall , et al. May 2, 2 | 2006-05-02 |
| Method and system for producing resilient solder joints App 20050148111 - Mortan, Robert F. | 2005-07-07 |
| Thermally enhanced semiconductor package App 20050133906 - Woodall, Joe D. ; et al. | 2005-06-23 |
| Flex resistant semiconductor die pad, leadframe, and package App 20040227216 - Mortan, Robert F. ; et al. | 2004-11-18 |
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