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name:-0.013417959213257
name:-0.013696908950806
name:-0.0054640769958496
Morriss; Jeff C. Patent Filings

Morriss; Jeff C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morriss; Jeff C..The latest application filed is for "extending multichip package link off package".

Company Profile
4.11.11
  • Morriss; Jeff C. - Los Gatos CA
  • Morriss; Jeff C. - Cornelius OR
  • Morriss; Jeff C. - Boulder Creek CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Extending multichip package link off package
Grant 11,386,033 - Das Sharma , et al. July 12, 2
2022-07-12
Extending multichip package link off package
Grant 11,113,225 - Das Sharma , et al. September 7, 2
2021-09-07
Single side band transmission over a waveguide
Grant 11,108,433 - Braunisch , et al. August 31, 2
2021-08-31
Extending Multichip Package Link Off Package
App 20210097015 - Das Sharma; Debendra ;   et al.
2021-04-01
Extending Multichip Package Link Off Package
App 20200409896 - Das Sharma; Debendra ;   et al.
2020-12-31
Rlink--die to die channel interconnect configurations to improve signaling
Grant 10,784,204 - Aygun , et al. Sept
2020-09-22
Extending multichip package link off package
Grant 10,678,736 - Das Sharma , et al.
2020-06-09
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling
App 20200066641 - AYGUN; Kemal ;   et al.
2020-02-27
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contact
Grant 10,396,036 - Zhang , et al. A
2019-08-27
Single Side Band Transmission Over A Waveguide
App 20190115951 - Braunisch; Henning ;   et al.
2019-04-18
Rlink-ground Shielding Attachment Structures And Shadow Voiding For Data Signal Contacts Of Package Devices; Vertical Ground Shielding Structures And Shield Fencing Of Vertical Data Signal Interconnects Of Package Devices; And Ground Shielding For Electro Optical Module Connector Data Signal Contact
App 20180331043 - ZHANG; Yu Amos ;   et al.
2018-11-15
Extending Multichip Package Link Off Package
App 20180276164 - Das Sharma; Debendra ;   et al.
2018-09-27
Providing a serial protocol for a bidirectional serial interconnect
Grant 9,524,265 - Harriman , et al. December 20, 2
2016-12-20
Providing A Serial Protocol For A Bidirectional Serial Interconnect
App 20150089107 - Harriman; David J. ;   et al.
2015-03-26
Modular Medical Devices
App 20090171163 - Mates; John W. ;   et al.
2009-07-02
Apparatus and method for high speed signals on a printed circuit board
App 20080252348 - Hannah; Eric C. ;   et al.
2008-10-16
Skew correction circuit
Grant 7,315,599 - Morriss January 1, 2
2008-01-01
Flexible PCB connector
App 20060228922 - Morriss; Jeff C.
2006-10-12
Method and apparatus for channel-based testing
App 20050071112 - Morriss, Jeff C. ;   et al.
2005-03-31
System for assigning geographical addresses in a hierarchical serial bus by enabling upstream port and selectively enabling disabled ports at power on/reset
Grant 5,623,610 - Knoll , et al. April 22, 1
1997-04-22
Method and apparatus for serial bus elements of an hierarchical serial bus assembly to electrically represent data and control states to each other
Grant 5,621,901 - Morriss , et al. April 15, 1
1997-04-15
System having independently addressable bus interfaces coupled to serially connected multi-ported signal distributors generating and maintaining frame based polling schedule favoring isochronous peripherals
Grant 5,615,404 - Knoll , et al. March 25, 1
1997-03-25

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