Morrison; William Robert
Patent Applications and Registrations
Patent applications and USPTO patent grants for Morrison; William Robert.The latest application filed is for "semiconductor device package with die cavity substrate".
- Morrison; William Robert - Dallas TX
| Patent | Date |
|---|---|
| Semiconductor Device Package With Die Cavity Substrate App 20220189836 - Morrison; William Robert ; et al. | 2022-06-16 |
| Coatings for relatively movable surfaces Grant 9,487,397 - Morrison , et al. November 8, 2 | 2016-11-08 |
| Coatings For Relatively Movable Surfaces App 20160060108 - MORRISON; William Robert ; et al. | 2016-03-03 |
| Coatings for relatively movable surfaces Grant 9,150,410 - Morrison , et al. October 6, 2 | 2015-10-06 |
| Coatings For Relatively Movable Surfaces App 20140329392 - MORRISON; William Robert ; et al. | 2014-11-06 |
| Coatings for relatively movable surfaces Grant 8,803,296 - Morrison , et al. August 12, 2 | 2014-08-12 |
| Coatings For Relatively Movable Surfaces App 20140167295 - MORRISON; William Robert ; et al. | 2014-06-19 |
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