Morrison; Gary P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morrison; Gary P..The latest application filed is for "ic device having low resistance tsv comprising ground connection".

Company Profile

0.9.8

Morrison; Gary P. - Garland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
IC device having low resistance TSV comprising ground connection Grant 8,436,475 - Dunne , et al. May 7, 2	2013-05-07
IC device having low resistance TSV comprising ground connection Grant 8,431,481 - Dunne , et al. April 30, 2	2013-04-30
IC Device Having Low Resistance TSV Comprising Ground Connection App 20120202321 - Dunne; Rajiv ; et al.	2012-08-09
IC Device Having Low Resistance TSV Comprising Ground Connection App 20120193814 - Dunne; Rajiv ; et al.	2012-08-02
IC device having low resistance TSV comprising ground connection Grant 8,178,976 - Dunne , et al. May 15, 2	2012-05-15
Packaged electronic devices with face-up die having TSV connection to leads and die pad Grant 8,154,134 - Bonifield , et al. April 10, 2	2012-04-10
Solder cap application process on copper bump using solder powder film Grant 7,790,597 - Chauhan , et al. September 7, 2	2010-09-07
Packaged Electronic Devices With Face-up Die Having Tsv Connection To Leads And Die Pad App 20090278245 - BONIFIELD; THOMAS D. ; et al.	2009-11-12
Ic Device Having Low Resistance Tsv Comprising Ground Connection App 20090278244 - DUNNE; RAJIV ; et al.	2009-11-12
Semiconductor Package Having A Grid Array Of Pin-attached Balls App 20090061566 - HOWARD; GREGORY E. ; et al.	2009-03-05
Solder Cap Application Process On Copper Bump Using Solder Powder Film App 20090014898 - Chauhan; Satyendra S. ; et al.	2009-01-15
Semiconductor package having a grid array of pin-attached balls Grant 7,462,783 - Howard , et al. December 9, 2	2008-12-09
Semiconductor package having a grid array of pin-attached balls App 20060021795 - Howard; Gregory E. ; et al.	2006-02-02
Ball grid array package for high speed devices Grant 6,762,498 - Morrison , et al. July 13, 2	2004-07-13
Chip-scale packages stacked on folded interconnector for vertical assembly on substrates App 20020114143 - Morrison, Gary P. ; et al.	2002-08-22

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