loadpatents
Patent applications and USPTO patent grants for Morozumi; Akira.The latest application filed is for "semiconductor module and manufacturing method of semiconductor module".
Patent | Date |
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Semiconductor module with reinforcing board Grant 10,461,012 - Morozumi , et al. Oc | 2019-10-29 |
Semiconductor module and manufacturing method of semiconductor module Grant 10,128,167 - Morozumi , et al. November 13, 2 | 2018-11-13 |
Semiconductor Module And Manufacturing Method Of Semiconductor Module App 20170271239 - MOROZUMI; Akira ;   et al. | 2017-09-21 |
Semiconductor device having a cooler Grant 9,673,130 - Gohara , et al. June 6, 2 | 2017-06-06 |
Semiconductor Device App 20160343640 - GOHARA; Hiromichi ;   et al. | 2016-11-24 |
Semiconductor Module Unit And Semiconductor Module App 20160190033 - MOROZUMI; Akira ;   et al. | 2016-06-30 |
Semiconductor module cooler and semiconductor module Grant 9,293,391 - Gohara , et al. March 22, 2 | 2016-03-22 |
Method for producing semiconductor device Grant 9,269,644 - Nishimura , et al. February 23, 2 | 2016-02-23 |
Semiconductor device Grant 9,263,367 - Nakagawa , et al. February 16, 2 | 2016-02-16 |
Cooling device for semiconductor module, and semiconductor module Grant 9,245,821 - Gohara , et al. January 26, 2 | 2016-01-26 |
Semiconductor module cooler and semiconductor module Grant 9,237,676 - Gohara , et al. January 12, 2 | 2016-01-12 |
Semiconductor module and heat radiation member Grant 9,179,578 - Soyano , et al. November 3, 2 | 2015-11-03 |
Semiconductor Device App 20150102480 - NAKAGAWA; Takaki ;   et al. | 2015-04-16 |
Semiconductor module and cooling unit Grant 8,933,557 - Gohara , et al. January 13, 2 | 2015-01-13 |
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20150008574 - GOHARA; Hiromichi ;   et al. | 2015-01-08 |
Semiconductor module and cooler Grant 8,902,589 - Gohara , et al. December 2, 2 | 2014-12-02 |
Semiconductor Module Cooler And Semiconductor Module App 20140252590 - Gohara; Hiromichi ;   et al. | 2014-09-11 |
Cooling Device For Semiconductor Module, And Semiconductor Module App 20140239486 - Gohara; Hiromichi ;   et al. | 2014-08-28 |
Method For Producing The Same App 20140080262 - NISHIMURA; Yoshitaka ;   et al. | 2014-03-20 |
Method for manufacturing a semiconductor device Grant 8,673,691 - Ikeda , et al. March 18, 2 | 2014-03-18 |
Semiconductor Module Cooler And Semiconductor Module App 20140043765 - Gohara; Hiromichi ;   et al. | 2014-02-13 |
Method For Manufacturing A Semiconductor Device App 20130267064 - IKEDA; Yoshinari ;   et al. | 2013-10-10 |
Semiconductor device Grant 8,450,845 - Ikeda , et al. May 28, 2 | 2013-05-28 |
Semiconductor Module And Cooler App 20130058041 - Gohara; Hiromichi ;   et al. | 2013-03-07 |
Semiconductor Module And Heat Radiation Member App 20120140420 - Soyano; Shin ;   et al. | 2012-06-07 |
Semiconductor Module And Cooling Unit App 20120139096 - Gohara; Hiromichi ;   et al. | 2012-06-07 |
Semiconductor Device And Semiconductor Device Manufacturing Method App 20110037166 - Ikeda; Yoshinari ;   et al. | 2011-02-17 |
Method for producing a semiconductor device using a solder alloy Grant 7,816,249 - Morozumi , et al. October 19, 2 | 2010-10-19 |
Manufacturing method of semiconductor device Grant 7,781,258 - Toba , et al. August 24, 2 | 2010-08-24 |
Semiconductor device App 20090289344 - Morozumi; Akira | 2009-11-26 |
Power semiconductor module App 20090166851 - Kobayashi; Takatoshi ;   et al. | 2009-07-02 |
Manufacturing method of semiconductor device App 20090130800 - Toba; Susumu ;   et al. | 2009-05-21 |
Method for producing a semiconductor device using a solder alloy App 20090093109 - Morozumi; Akira ;   et al. | 2009-04-09 |
Semiconductor device and manufacturing method thereof Grant 7,514,785 - Toba , et al. April 7, 2 | 2009-04-07 |
Solder alloy and a semiconductor device using the solder alloy App 20060263235 - Morozumi; Akira ;   et al. | 2006-11-23 |
Semiconductor device and manufacturing method thereof App 20060186520 - Toba; Susumu ;   et al. | 2006-08-24 |
Semiconductor device and method for producing the same App 20060157862 - Nishimura; Yoshitaka ;   et al. | 2006-07-20 |
Power semiconductor module App 20050218426 - Kobayashi, Takatoshi ;   et al. | 2005-10-06 |
Power semiconductor module Grant 6,914,325 - Kobayashi , et al. July 5, 2 | 2005-07-05 |
Method of manufacturing semiconductor device Grant 6,905,063 - Morozumi , et al. June 14, 2 | 2005-06-14 |
Semiconductor device and method of relaxing thermal stress Grant 6,844,621 - Morozumi , et al. January 18, 2 | 2005-01-18 |
Semiconductor device and method of relaxing thermal stress App 20040102023 - Morozumi, Akira ;   et al. | 2004-05-27 |
Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base Grant 6,690,087 - Kobayashi , et al. February 10, 2 | 2004-02-10 |
Power semiconductor module App 20040017005 - Kobayashi, Takatoshi ;   et al. | 2004-01-29 |
Method of manufacturing semiconductor device App 20030222126 - Morozumi, Akira ;   et al. | 2003-12-04 |
Power semiconductor module App 20020109152 - Kobayashi, Takatoshi ;   et al. | 2002-08-15 |
Insulation substrate for a semiconductor device Grant 5,869,890 - Nishiura , et al. February 9, 1 | 1999-02-09 |
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