loadpatents
name:-0.023853063583374
name:-0.025152206420898
name:-0.001439094543457
Morozumi; Akira Patent Filings

Morozumi; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morozumi; Akira.The latest application filed is for "semiconductor module and manufacturing method of semiconductor module".

Company Profile
1.28.30
  • Morozumi; Akira - Okaya JP
  • MOROZUMI; Akira - Okaya-city JP
  • MOROZUMI; Akira - Okaya-shi JP
  • Morozumi; Akira - Nagano N/A JP
  • Morozumi; Akira - Kawasaki JP
  • MOROZUMI; Akira - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor module with reinforcing board
Grant 10,461,012 - Morozumi , et al. Oc
2019-10-29
Semiconductor module and manufacturing method of semiconductor module
Grant 10,128,167 - Morozumi , et al. November 13, 2
2018-11-13
Semiconductor Module And Manufacturing Method Of Semiconductor Module
App 20170271239 - MOROZUMI; Akira ;   et al.
2017-09-21
Semiconductor device having a cooler
Grant 9,673,130 - Gohara , et al. June 6, 2
2017-06-06
Semiconductor Device
App 20160343640 - GOHARA; Hiromichi ;   et al.
2016-11-24
Semiconductor Module Unit And Semiconductor Module
App 20160190033 - MOROZUMI; Akira ;   et al.
2016-06-30
Semiconductor module cooler and semiconductor module
Grant 9,293,391 - Gohara , et al. March 22, 2
2016-03-22
Method for producing semiconductor device
Grant 9,269,644 - Nishimura , et al. February 23, 2
2016-02-23
Semiconductor device
Grant 9,263,367 - Nakagawa , et al. February 16, 2
2016-02-16
Cooling device for semiconductor module, and semiconductor module
Grant 9,245,821 - Gohara , et al. January 26, 2
2016-01-26
Semiconductor module cooler and semiconductor module
Grant 9,237,676 - Gohara , et al. January 12, 2
2016-01-12
Semiconductor module and heat radiation member
Grant 9,179,578 - Soyano , et al. November 3, 2
2015-11-03
Semiconductor Device
App 20150102480 - NAKAGAWA; Takaki ;   et al.
2015-04-16
Semiconductor module and cooling unit
Grant 8,933,557 - Gohara , et al. January 13, 2
2015-01-13
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20150008574 - GOHARA; Hiromichi ;   et al.
2015-01-08
Semiconductor module and cooler
Grant 8,902,589 - Gohara , et al. December 2, 2
2014-12-02
Semiconductor Module Cooler And Semiconductor Module
App 20140252590 - Gohara; Hiromichi ;   et al.
2014-09-11
Cooling Device For Semiconductor Module, And Semiconductor Module
App 20140239486 - Gohara; Hiromichi ;   et al.
2014-08-28
Method For Producing The Same
App 20140080262 - NISHIMURA; Yoshitaka ;   et al.
2014-03-20
Method for manufacturing a semiconductor device
Grant 8,673,691 - Ikeda , et al. March 18, 2
2014-03-18
Semiconductor Module Cooler And Semiconductor Module
App 20140043765 - Gohara; Hiromichi ;   et al.
2014-02-13
Method For Manufacturing A Semiconductor Device
App 20130267064 - IKEDA; Yoshinari ;   et al.
2013-10-10
Semiconductor device
Grant 8,450,845 - Ikeda , et al. May 28, 2
2013-05-28
Semiconductor Module And Cooler
App 20130058041 - Gohara; Hiromichi ;   et al.
2013-03-07
Semiconductor Module And Heat Radiation Member
App 20120140420 - Soyano; Shin ;   et al.
2012-06-07
Semiconductor Module And Cooling Unit
App 20120139096 - Gohara; Hiromichi ;   et al.
2012-06-07
Semiconductor Device And Semiconductor Device Manufacturing Method
App 20110037166 - Ikeda; Yoshinari ;   et al.
2011-02-17
Method for producing a semiconductor device using a solder alloy
Grant 7,816,249 - Morozumi , et al. October 19, 2
2010-10-19
Manufacturing method of semiconductor device
Grant 7,781,258 - Toba , et al. August 24, 2
2010-08-24
Semiconductor device
App 20090289344 - Morozumi; Akira
2009-11-26
Power semiconductor module
App 20090166851 - Kobayashi; Takatoshi ;   et al.
2009-07-02
Manufacturing method of semiconductor device
App 20090130800 - Toba; Susumu ;   et al.
2009-05-21
Method for producing a semiconductor device using a solder alloy
App 20090093109 - Morozumi; Akira ;   et al.
2009-04-09
Semiconductor device and manufacturing method thereof
Grant 7,514,785 - Toba , et al. April 7, 2
2009-04-07
Solder alloy and a semiconductor device using the solder alloy
App 20060263235 - Morozumi; Akira ;   et al.
2006-11-23
Semiconductor device and manufacturing method thereof
App 20060186520 - Toba; Susumu ;   et al.
2006-08-24
Semiconductor device and method for producing the same
App 20060157862 - Nishimura; Yoshitaka ;   et al.
2006-07-20
Power semiconductor module
App 20050218426 - Kobayashi, Takatoshi ;   et al.
2005-10-06
Power semiconductor module
Grant 6,914,325 - Kobayashi , et al. July 5, 2
2005-07-05
Method of manufacturing semiconductor device
Grant 6,905,063 - Morozumi , et al. June 14, 2
2005-06-14
Semiconductor device and method of relaxing thermal stress
Grant 6,844,621 - Morozumi , et al. January 18, 2
2005-01-18
Semiconductor device and method of relaxing thermal stress
App 20040102023 - Morozumi, Akira ;   et al.
2004-05-27
Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base
Grant 6,690,087 - Kobayashi , et al. February 10, 2
2004-02-10
Power semiconductor module
App 20040017005 - Kobayashi, Takatoshi ;   et al.
2004-01-29
Method of manufacturing semiconductor device
App 20030222126 - Morozumi, Akira ;   et al.
2003-12-04
Power semiconductor module
App 20020109152 - Kobayashi, Takatoshi ;   et al.
2002-08-15
Insulation substrate for a semiconductor device
Grant 5,869,890 - Nishiura , et al. February 9, 1
1999-02-09

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