loadpatents
Patent applications and USPTO patent grants for Moriya; Yuta.The latest application filed is for "resin shaping mold and method of producing resin molded product".
Patent | Date |
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Resin shaping mold and method of producing resin molded product Grant 11,179,872 - Moriya , et al. November 23, 2 | 2021-11-23 |
Resin Shaping Mold And Method Of Producing Resin Molded Product App 20190118440 - Moriya; Yuta ;   et al. | 2019-04-25 |
Resin molded article, method for manufacturing the same, and printer Grant 10,252,453 - Moriya , et al. | 2019-04-09 |
Semiconductor device and method for manufacturing the same Grant 10,134,766 - Hayakawa , et al. November 20, 2 | 2018-11-20 |
Resin Molded Article, Method For Manufacturing The Same, And Printer App 20170129150 - Moriya; Yuta ;   et al. | 2017-05-11 |
Semiconductor Device And Method For Manufacturing The Same App 20170033129 - HAYAKAWA; Masahiko ;   et al. | 2017-02-02 |
Semiconductor device and liquid crystal display device containing the same Grant 9,494,829 - Hayakawa , et al. November 15, 2 | 2016-11-15 |
Semiconductor Device And Method For Manufacturing The Same App 20120194756 - HAYAKAWA; Masahiko ;   et al. | 2012-08-02 |
Resin Molded Article, Method For Manufacturing The Same, And Printer App 20120156429 - Moriya; Yuta ;   et al. | 2012-06-21 |
Display apparatus Grant 7,570,315 - Tanaka , et al. August 4, 2 | 2009-08-04 |
Display apparatus App 20070064170 - Tanaka; Shinya ;   et al. | 2007-03-22 |
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