loadpatents
name:-0.022855997085571
name:-0.016093969345093
name:-0.0033450126647949
Moriya; Yoichi Patent Filings

Moriya; Yoichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moriya; Yoichi.The latest application filed is for "power module and method for manufacturing power module".

Company Profile
2.17.20
  • Moriya; Yoichi - Nagaokakyo JP
  • MORIYA; Yoichi - Nagaokakyo-shi JP
  • Moriya; Yoichi - Kyoto JP
  • Moriya; Yoichi - Omihachiman JP
  • MORIYA; Yoichi - Omihachiman-shi JP
  • Moriya; Yoichi - Kyoto-shi JP
  • Moriya, Yoichi - Shiga-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Power module and method for manufacturing power module
Grant 11,114,355 - Hayakawa , et al. September 7, 2
2021-09-07
Composite ceramic multilayer substrate, heat generating element-mounting module, and method of producing composite ceramic multilayer substrate
Grant 11,107,741 - Kato , et al. August 31, 2
2021-08-31
Composite Ceramic Multilayer Substrate, Heat Generating Element-mounting Module, And Method Of Producing Composite Ceramic Multi
App 20190371689 - KATO; Tomoki ;   et al.
2019-12-05
Power Module And Method For Manufacturing Power Module
App 20190371702 - HAYAKAWA; Takahiro ;   et al.
2019-12-05
Circuit Board And Circuit Board Manufacturing Method
App 20150173185 - Ito; Satoshi ;   et al.
2015-06-18
Semiconductor device
Grant 9,030,005 - Moriya , et al. May 12, 2
2015-05-12
Metal base substrate and manufacturing method thereof
Grant 8,980,028 - Moriya , et al. March 17, 2
2015-03-17
Wiring Board
App 20140118977 - ITO; Satoshi ;   et al.
2014-05-01
Semiconductor Device
App 20140070394 - MORIYA; Yoichi ;   et al.
2014-03-13
Ceramic sintered body and method for producing ceramic sintered body
Grant 8,652,982 - Motoya , et al. February 18, 2
2014-02-18
Circuit Board And Method Of Manufacturing The Same
App 20140022750 - MORIYA; Yoichi ;   et al.
2014-01-23
Wiring Substrate
App 20140009899 - ITO; Satoshi ;   et al.
2014-01-09
Metal Base Substrate
App 20130266782 - MORIYA; Yoichi ;   et al.
2013-10-10
Metal Base Substrate And Manufacturing Method Thereof
App 20130264723 - MORIYA; Yoichi ;   et al.
2013-10-10
Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer
Grant 8,361,918 - Motoya , et al. January 29, 2
2013-01-29
Ceramic Sintered Body And Method For Producing Ceramic Sintered Body
App 20120329633 - Motoya; Machiko ;   et al.
2012-12-27
Method for producing forsterite powder, forsterite powder, sintered forsterite, insulating ceramic composition, and multilayer ceramic electronic component
Grant 7,824,642 - Moriya , et al. November 2, 2
2010-11-02
Method For Producing Powder Forsterite Powder, Forsterite Powder, Sintered Forsterite, Insulating Ceramic Composition, And Multilayer Ceramic Electronic Component
App 20100170705 - MORIYA; Yoichi ;   et al.
2010-07-08
Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer
App 20100139957 - MOTOYA; Machiko ;   et al.
2010-06-10
Method for producing powder forsterite powder, forsterite powder, sintered forsterite, insulating ceramic composition, and multilayer ceramic electronic component
Grant 7,704,477 - Moriya , et al. April 27, 2
2010-04-27
Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
Grant 7,439,202 - Mori , et al. October 21, 2
2008-10-21
Method For Producing Powder Forsterite Powder, Forsterite Powder, Sintered Forsterite, Insulating Ceramic Composition, And Multilayer Ceramic Electronic Component
App 20080253954 - Moriya; Yoichi ;   et al.
2008-10-16
Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
Grant 7,417,001 - Mori , et al. August 26, 2
2008-08-26
Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
Grant 7,368,408 - Mori , et al. May 6, 2
2008-05-06
Insulating ceramic composition, insulating ceramic sintered body, and mulitlayer ceramic electronic component
Grant 7,351,674 - Mori , et al. April 1, 2
2008-04-01
Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
App 20070237935 - Mori; Naoya ;   et al.
2007-10-11
Glass Ceramic Composition, Glass-ceramic Sintered Body, And Monolithic Ceramic Electronic Component
App 20070128450 - Mori; Naoya ;   et al.
2007-06-07
Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component
App 20060287184 - Mori; Naoya ;   et al.
2006-12-21
Composition for insulating ceramics and insulating ceramics using the same
Grant 6,946,415 - Chikagawa , et al. September 20, 2
2005-09-20
Glass-ceramic composite material and multilayered circuit substrate
Grant 6,878,464 - Moriya , et al. April 12, 2
2005-04-12
Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product
Grant 6,797,093 - Moriya , et al. September 28, 2
2004-09-28
Composition for insulating ceramics and insulating ceramics using the same
App 20040029701 - Chikagawa, Osamu ;   et al.
2004-02-12
Glass-ceramic composite material and multilayered circuit substrate
App 20030118842 - Moriya, Yoichi ;   et al.
2003-06-26
Method of manufacturing glass ceramic multilayer substrate
App 20030062111 - Moriya, Yoichi
2003-04-03
Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product
App 20020189742 - Moriya, Yoichi ;   et al.
2002-12-19

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