Moriya; Yasuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moriya; Yasuo.The latest application filed is for "electrical device and method of producing the same".

Company Profile

0.9.9

Moriya; Yasuo - Kawasaki JP
Moriya, Yasuo - Kawasaki-shi JP
Moriya; Yasuo - Tokyo JP
Moriya; Yasuo - Chita JP
Moriya; Yasuo - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical Device And Method Of Producing The Same App 20160224061 - Noda; Yutaka ; et al.	2016-08-04
Method for manufacturing electronic device and electronic device Grant 9,391,031 - Takahashi , et al. July 12, 2	2016-07-12
Method For Manufacturing Electronic Device And Electronic Device App 20140084491 - TAKAHASHI; Tetsuya ; et al.	2014-03-27
Printed Circuit Board Manufacturing Method App 20130255878 - TAKAHASHI; Tetsuya ; et al.	2013-10-03
Interposer, Circuit Board Module, And Method For Manufacturing Interposer App 20130087376 - MORIYA; Yasuo	2013-04-11
Method of assembling a carriage assembly Grant 7,581,309 - Matsumura , et al. September 1, 2	2009-09-01
Method of assembling a carriage assembly and assembling apparatus App 20070119045 - Matsumura; Takayoshi ; et al.	2007-05-31
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy Grant 6,984,254 - Takesue , et al. January 10, 2	2006-01-10
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20040052678 - Takesue, Masakazu ; et al.	2004-03-18
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20030095888 - Kitajima, Masayuki ; et al.	2003-05-22
Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom Grant 6,420,476 - Yamada , et al. July 16, 2	2002-07-16
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy App 20010001990 - Kitajima, Masayuki ; et al.	2001-05-31
Lead-free solder composition with Bi, In and Sn Grant 6,184,475 - Kitajima , et al. February 6, 2	2001-02-06
Method of manufacturing a grafted resin composition Grant 4,839,432 - Moriya , et al. June 13, 1	1989-06-13
Block copolymer Grant 4,665,131 - Moriya , et al. May 12, 1	1987-05-12
Method for producing a plastic lens Grant 4,607,087 - Moriya , et al. August 19, 1	1986-08-19
Process for producing low molecular weight styrene series polymers Grant 4,237,257 - Moriya , et al. December 2, 1	1980-12-02

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