Morita; Shuhei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Morita; Shuhei.The latest application filed is for "ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module".
- Morita; Shuhei - Omuta JP
- MORITA; Shuhei - Omuta-shi JP
| Patent | Date |
|---|---|
| Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board Grant 11,452,204 - Harada , et al. September 20, 2 | 2022-09-20 |
| Ceramic circuit board and method for producing same Grant 11,277,908 - Yuasa , et al. March 15, 2 | 2022-03-15 |
| Ceramic-copper Composite, Method Of Producing Ceramic-copper Composite, Ceramic Circuit Board, And Power Module App 20220009842 - YUASA; Akimasa ; et al. | 2022-01-13 |
| Ceramic Circuit Board And Method For Producing Same App 20210176859 - YUASA; Akimasa ; et al. | 2021-06-10 |
| Ceramic Circuit Board And Production Method Therefor App 20200163210 - YUASA; Akimasa ; et al. | 2020-05-21 |
| Ceramic Circuit Board, Method For Manufacturing Ceramic Circuit Board, And Module Using Ceramic Circuit Board App 20200128664 - HARADA; Yusaku ; et al. | 2020-04-23 |
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