Morita; Hiromichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Morita; Hiromichi.The latest application filed is for "wafer processing method, wafer polishing apparatus, and ingot slicing apparatus".
- Morita; Hiromichi - Kariya N/A JP
- Morita; Hiromichi - Kariya-city JP
- Morita, Hiromichi - Kariya-shi JP
| Patent | Date |
|---|---|
| Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus Grant 8,758,087 - Koutake , et al. June 24, 2 | 2014-06-24 |
| Wafer Processing Method, Wafer Polishing Apparatus, And Ingot Slicing Apparatus App 20110294403 - KOUTAKE; Kyohei ; et al. | 2011-12-01 |
| Method and device for removing burr by high-density energy beam App 20060065648 - Kameyama; Michio ; et al. | 2006-03-30 |
| Injector nozzle and method of manufacturing injector nozzle Grant 7,003,880 - Morita February 28, 2 | 2006-02-28 |
| Table feed system Grant 6,626,082 - Morita , et al. September 30, 2 | 2003-09-30 |
| Injector nozzle and method of manufacturing injector nozzle App 20030075622 - Morita, Hiromichi | 2003-04-24 |
| Method of charging hole with fluid material App 20030026899 - Morita, Hiromichi ; et al. | 2003-02-06 |
| Table feed system App 20020026869 - Morita, Hiromichi ; et al. | 2002-03-07 |
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