Morishima; Masayuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Morishima; Masayuki.The latest application filed is for "sealing resin for flip-flop mounting".
- Morishima; Masayuki - Yokohama JP
- Morishima, Masayuki - Chiba JP
- Morishima, Masayuki - Tochigi-ken JP
- Morishima; Masayuki - Kiryu JP
| Patent | Date |
|---|---|
| Method of forming bumps Grant 6,869,008 - Inoue , et al. March 22, 2 | 2005-03-22 |
| Sealing resin for flip-flop mounting App 20030011077 - Morishima, Masayuki ; et al. | 2003-01-16 |
| Order receiving and ordering system App 20020087431 - Morishima, Masayuki | 2002-07-04 |
| Method of forming bumps Grant 6,402,014 - Inoue , et al. June 11, 2 | 2002-06-11 |
| Method of forming bumps Grant 6,213,386 - Inoue , et al. April 10, 2 | 2001-04-10 |
| Induction heating cooking apparatus Grant 4,556,770 - Tazima , et al. December 3, 1 | 1985-12-03 |
| Induction heating cooking apparatus Grant 4,536,631 - Tazima , et al. August 20, 1 | 1985-08-20 |
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