Morisawa; Shinya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morisawa; Shinya.The latest application filed is for "substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method".

Company Profile

2.12.15

Morisawa; Shinya - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method Grant 11,426,834 - Miyazaki , et al. August 30, 2	2022-08-30
Substrate Processing Apparatus, Substrate Processing Method, Substrate Holding Mechanism, And Substrate Holding Method App 20200047309 - Miyazaki; Mitsuru ; et al.	2020-02-13
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method Grant 10,486,285 - Miyazaki , et al. Nov	2019-11-26
Substrate Processing Apparatus, Substrate Processing Method, Substrate Holding Mechanism, And Substrate Holding Method App 20170252894 - MIYAZAKI; Mitsuru ; et al.	2017-09-07
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method Grant 9,687,957 - Miyazaki , et al. June 27, 2	2017-06-27
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method Grant 9,358,662 - Miyazaki , et al. June 7, 2	2016-06-07
Substrate Processing Apparatus, Substrate Processing Method, Substrate Holding Mechanism, And Substrate Holding Method App 20150050863 - MIYAZAKI; Mitsuru ; et al.	2015-02-19
Substrate Processing Apparatus, Substrate Processing Method, Substrate Holding Mechanism, And Substrate Holding Method App 20140302676 - MIYAZAKI; Mitsuru ; et al.	2014-10-09
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method Grant 8,795,032 - Miyazaki , et al. August 5, 2	2014-08-05
Plating Apparatus And Plating Method App 20100219078 - KURASHINA; Keiichi ; et al.	2010-09-02
Plating apparatus and plating method Grant 7,736,474 - Kurashina , et al. June 15, 2	2010-06-15
Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method App 20090305612 - Miyazaki; Mitsuru ; et al.	2009-12-10
Substrate cleaning apparatus App 20090101181 - Morisawa; Shinya ; et al.	2009-04-23
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20090026068 - Hongo; Akihisa ; et al.	2009-01-29
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20070113977 - Hongo; Akihisa ; et al.	2007-05-24
Wafer cleaning apparatus Grant 7,037,853 - Hongo , et al. May 2, 2	2006-05-02
Plating apparatus and plating method App 20060086616 - Kurashina; Keiichi ; et al.	2006-04-27
Revolution member supporting apparatus and semiconductor substrate processing apparatus Grant 6,921,466 - Hongo , et al. July 26, 2	2005-07-26
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20050087441 - Hongo, Akihisa ; et al.	2005-04-28
Plating apparatus, plating method and substrate processing apparatus App 20050023149 - Nakada, Tsutomu ; et al.	2005-02-03
Method of and apparatus for cleaning substrate Grant 6,745,784 - Katakabe , et al. June 8, 2	2004-06-08
Wafer cleaning apparatus App 20040007559 - Hongo, Akihisa ; et al.	2004-01-15
Method of and apparatus for cleaning substrate App 20030168089 - Katakabe, Ichiro ; et al.	2003-09-11
Wafer cleaning apparatus Grant 6,615,854 - Hongo , et al. September 9, 2	2003-09-09
Method of and apparatus for cleaning substrate Grant 6,558,478 - Katakabe , et al. May 6, 2	2003-05-06
Revolution member supporting apparatus and semiconductor substrate processing apparatus App 20020006876 - Hongo, Akihisa ; et al.	2002-01-17

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