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name:-0.0073690414428711
name:-0.00056791305541992
MORIROKU COMPANY, LTD. Patent Filings

MORIROKU COMPANY, LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MORIROKU COMPANY, LTD..The latest application filed is for "method of injection molding".

Company Profile
0.5.5
  • MORIROKU COMPANY, LTD. - Tokyo JP
  • MORIROKU COMPANY, LTD. - 1-1-1, Minami-Aoyama Minato-ku Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method Of Injection Molding
App 20120043696 - BABA; Hideki ;   et al.
2012-02-23
Apparatus for injection molding
Grant 8,062,016 - Baba , et al. November 22, 2
2011-11-22
Vehicle console with adjustable armrest
Grant 7,770,953 - Koarai August 10, 2
2010-08-10
Console box
Grant 7,614,674 - Shiono , et al. November 10, 2
2009-11-10
Sealing structure
Grant 7,523,982 - Yamaguchi April 28, 2
2009-04-28
Vehicle Console With Adjustable Armrest
App 20090066103 - Koarai; Manabu
2009-03-12
Component parts joining structure
Grant 7,410,206 - Koarai August 12, 2
2008-08-12
Sealing Structure
App 20080073860 - Yamaguchi; Takayuki
2008-03-27
Component Parts Joining Structure
App 20070117456 - Koarai; Manabu
2007-05-24
Apparatus And Method Of Injection Molding
App 20070045899 - BABA; Hideki ;   et al.
2007-03-01

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