Morioka; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morioka; Satoru.The latest application filed is for "production method of additive manufactured object using pure copper powder having si coating".

Company Profile

2.4.13

Morioka; Satoru - Tokyo JP
Morioka; Satoru - Toda-shi JP
Morioka; Satoru - Toda JP
Morioka; Satoru - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
PRODUCTION METHOD OF ADDITIVE MANUFACTURED OBJECT USING PURE COPPER POWDER HAVING Si COATING App 20210039192 - Watanabe; Hirofumi ; et al.	2021-02-11
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board Grant 10,464,291 - Momoi , et al. No	2019-11-05
Printed wiring board, electronic device, catheter, and metallic material Grant 10,194,534 - Arai , et al. Ja	2019-01-29
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation App 20180035529 - ARAI; HIDETA ; et al.	2018-02-01
Printed Wiring Board, Electronic Device, Catheter, And Metallic Material App 20180035546 - ARAI; HIDETA ; et al.	2018-02-01
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation App 20170347493 - Arai; Hideta ; et al.	2017-11-30
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board App 20170291397 - MOMOI; Hajime ; et al.	2017-10-12
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board Grant 9,724,896 - Momoi , et al. August 8, 2	2017-08-08
Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board App 20160212836 - Arai; Hideta ; et al.	2016-07-21
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board App 20160120017 - MOMOI; HAJIME ; et al.	2016-04-28
Method For Producing Nitride Compound Semiconductor Substrate, And Nitride Compound Semiconductor Free-standing Substrate App 20120256297 - Morioka; Satoru ; et al.	2012-10-11
Crystal Growing Apparatus, Method For Manufacturing Nitride Compound Semiconductor Crystal, And Nitride Compound Semiconductor Crystal App 20120251428 - Morioka; Satoru	2012-10-04
Manufacturing method of GaN thin film template substrate, GaN thin film template substrate and GaN thick film single crystal Grant 8,137,460 - Morioka , et al. March 20, 2	2012-03-20
MANUFACTURING METHOD OF GaN BASED SEMICONDUCTOR EPITAXIAL SUBSTRATE App 20110244665 - MIKAMI; Makoto ; et al.	2011-10-06
Epitaxial Growth Substrate, Manufacturing Method Thereof, Nitride-based Compound Semiconductor Substrate, And Nitride-based Compound Semiconductor Self-supporting Substrate App 20110215439 - MORIOKA; Satoru	2011-09-08
Substrate For Epitaxial Growth And Method For Producing Nitride Compound Semiconductor Single Crystal App 20100101486 - Takakusaki; Misao ; et al.	2010-04-29
MANUFACTURING METHOD OF GaN THIN FILM TEMPLATE SUBSTRATE, GaN THIN FILM TEMPLATE SUBSTRATE AND GaN THICK FILM SINGLE CRYSTAL App 20090294774 - Morioka; Satoru ; et al.	2009-12-03

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